Magnetron sputtering target and process for producing the same

Patent metadata

Field	Value
Publication number	US-9928996-B2
Application number	US-201414313787-A
Country	US
Kind code	B2
Filing date	Jun 24, 2014
Priority date	Aug 6, 2010
Publication date	Mar 27, 2018
Grant date	Mar 27, 2018

Abstract

A process for producing a magnetron sputtering target includes: mixing and dispersing an oxide powder and a magnetic metal powder, the magnetic metal powder containing a ferromagnetic metal element, to obtain a magnetic powder mixture; mixing and dispersing an oxide powder and each of a plurality of non-magnetic metal powders, the plurality of non-magnetic metal powders containing the ferromagnetic metal element, the plurality of non-magnetic metal powders containing a different constituent element from each other or containing constituent elements at different ratios from each other, to obtain a plurality of non-magnetic powder mixtures; and mixing and dispersing the magnetic powder mixture and the plurality of non-magnetic powder mixtures to obtain a powder mixture for pressure sintering.

First claim

The invention claimed is:

1. A process for producing a magnetron sputtering target, the process comprising the steps of:
forming a magnetic powder mixture by mixing and dispersing an oxide powder and a magnetic metal powder, the magnetic metal powder containing a ferromagnetic metal element;
forming a plurality of non-magnetic powder mixtures by separately mixing and dispersing an oxide powder and each of a corresponding plurality of non-magnetic metal powders, each of the plurality of non-magnetic metal powders containing the ferromagnetic metal element, each of the plurality of non-magnetic metal powders containing a different constituent element from each other or containing constituent elements at different ratios from each other; and
mixing and dispersing the magnetic powder mixture and the plurality of non-magnetic powder mixtures to obtain a powder mixture for pressure sintering.

2. The process for producing a magnetron sputtering target according to claim 1 , wherein magnetic metal particles in the magnetic powder mixture are covered with an oxide powder, and non-magnetic metal particles in the plurality of non-magnetic powder mixtures are covered with an oxide powder.

3. The process for producing a magnetron sputtering target according to claim 1 , wherein the plurality of non-magnetic metal powders are two non-magnetic metal powders.

4. The process for producing a magnetron sputtering target according to claim 1 , wherein the ferromagnetic metal element is Co.

5. The process for producing a magnetron sputtering target according to claim 4 , wherein the magnetic metal powder contains Co and Cr as main components, and a ratio of an amount of Co contained in the magnetic metal powder is not less than 85 at %.

6. The process for producing a magnetron sputtering target according to claim 4 , wherein the magnetic metal powder is composed only of Co.

7. The process for producing a magnetron sputtering target according to claim 4 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Cr alloy in which a ratio of an amount of Co is more than 0 at % and not more than 75 at % or a Co—Cr—Pt alloy in which a ratio of an amount of Co is more than 0 at % and not more than 73 at %.

8. The process for producing a magnetron sputtering target according to claim 4 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Pt alloy in which a ratio of an amount of Co is more than 0 at % and not more than 12 at %.

9. A process for producing a magnetron sputtering target, the process comprising the steps of:
forming a magnetic powder mixture by mixing and dispersing an oxide powder and a magnetic metal powder, the magnetic metal powder containing a ferromagnetic metal element;
forming a plurality of non-magnetic powder mixtures by separately mixing and dispersing an oxide powder and each of a corresponding plurality of non-magnetic metal powders, each of the plurality of non-magnetic metal powders containing the ferromagnetic metal element, each of the plurality of non-magnetic metal powders containing a different constituent element from each other or containing constituent elements at different ratios from each other; and
mixing and dispersing the magnetic powder mixture, the plurality of non-magnetic powder mixtures, and an oxide powder to obtain a powder mixture for pressure sintering.

10. The process for producing a magnetron sputtering target according to claim 9 , wherein magnetic metal particles in the magnetic powder mixture are covered with an oxide powder, and non-magnetic metal particles in the plurality of non-magnetic powder mixtures are covered with an oxide powder.

11. The process for producing a magnetron sputtering target according to claim 9 , wherein the plurality of non-magnetic metal powders are two non-magnetic metal powders.

12. The process for producing a magnetron sputtering target according to claim 9 , wherein the ferromagnetic metal element is Co.

13. The process for producing a magnetron sputtering target according to claim 12 , wherein the magnetic metal powder contains Co and Cr as main components, and a ratio of an amount of Co contained in the magnetic metal powder is not less than 85 at %.

14. The process for producing a magnetron sputtering target according to claim 12 , wherein the magnetic metal powder is composed only of Co.

15. The process for producing a magnetron sputtering target according to claim 12 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Cr alloy in which a ratio of an amount of Co is more than 0 at % and not more than 75 at% or a Co-Cr-Pt alloy in which a ratio of an amount of Co is more than 0 at % and not more than 73 at %.

16. The process for producing a magnetron sputtering target according to claim 12 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Pt alloy in which a ratio of an amount of Co is more than 0 at % and not more than 12 at %.

Assignees

• Tanaka Precious Metal Ind

Inventors

• Miyashita Takanobu
• Goto Yasuyuki

Classifications

• B22F1/16

  Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title

• C22C38/30

  with cobalt · CPC title

• H01F41/183

  Sputtering targets therefor · CPC title

• C22C1/0433

  Nickel- or cobalt-based alloys · CPC title

• C22C19/07

  based on cobalt · CPC title