Soft magnetic multilayer desposition apparatus, methods of manufacturing and magnetic multilayer
US-2024186064-A1 · Jun 6, 2024 · US
Sputtering targets therefor
Sputtering targets therefor · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H01F41/183 |
| Official title | {Sputtering targets therefor} |
| Display label | Sputtering targets therefor |
| Total patents | 62 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 8 |
| 2017 | 5 |
| 2018 | 4 |
| 2019 | 3 |
| 2020 | 13 |
| 2021 | 6 |
| 2022 | 5 |
| 2023 | 5 |
| 2024 | 1 |
| 2025 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
In-plane magnetized film, in-plane magnetized film multilayer structure, hard bias layer, magnetoresistive element, and sputtering target
US-11810700-B2 · Nov 7, 2023 · US
Method of depositing a material
US-2023220539-A1 · Jul 13, 2023 · US
In-plane magnetized film, in-plane magnetized film multilayer structure, hard bias layer, magnetoresistance effect element, and sputtering target
US-2023187109-A1 · Jun 15, 2023 · US
Nonmagnetic material-dispersed fe-pt based sputtering target
US-2023125486-A1 · Apr 27, 2023 · US
Sputtering Target Material and Method of Producing the Same
US-2023076444-A1 · Mar 9, 2023 · US
Sputtering target and method of producing sputtering target
US-11421315-B2 · Aug 23, 2022 · US
Bias magnetic field control method, magnetic thin film deposition method,chamber, and apparatus
US-2022228253-A1 · Jul 21, 2022 · US
Sputtering target material
US-11377726-B2 · Jul 5, 2022 · US
Stage device and processing apparatus
US-11293092-B2 · Apr 5, 2022 · US
Sputtering Target, Method for Producing Laminated Film, Laminated Film and Magnetic Recording Medium
US-2022005505-A1 · Jan 6, 2022 · US
Magnetic alloy material
US-2021395865-A1 · Dec 23, 2021 · US
In-plane magnetized film, in-plane magnetized film multilayer structure, hard bias layer, magnetoresistive element, and sputtering target
US-2021391105-A1 · Dec 16, 2021 · US
Method for forming magnetic film and method for manufacturing magnetic storage element
US-11189784-B2 · Nov 30, 2021 · US
Sputtering target and method of producing sputtering target
US-2021172056-A1 · Jun 10, 2021 · US
Fe—Pt based magnetic material sintered compact
US-10937455-B2 · Mar 2, 2021 · US
Fe-Pt-OXIDE-BN-BASED SINTERED COMPACT FOR SPUTTERING TARGET
US-2021032741-A1 · Feb 4, 2021 · US
Method for forming magnetic film and method for manufacturing magnetic storage element
US-2020381616-A1 · Dec 3, 2020 · US
Sputtering target material
US-10844476-B2 · Nov 24, 2020 · US
Sputtering Target Material
US-2020362451-A1 · Nov 19, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H01F41/183?
- CPC H01F41/183 is the Cooperative Patent Classification code for “Sputtering targets therefor.”
- How many patents are filed under CPC H01F41/183 (Sputtering targets therefor)?
- Our database includes 62 publications tagged with this CPC code.
- Is patent activity under CPC H01F41/183 growing?
- Publication counts under this code: 1 in 2024 vs 2 in 2025 (latest complete years).