Magnetron sputtering target and method for manufacturing the same

US9502224B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9502224-B2
Application numberUS-201214357852-A
CountryUS
Kind codeB2
Filing dateOct 12, 2012
Priority dateNov 17, 2011
Publication dateNov 22, 2016
Grant dateNov 22, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided is a magnetron sputtering target having a ferromagnetic metal element. This magnetron sputtering target includes: a magnetic phase containing the ferromagnetic metal element; a plurality of non-magnetic phases that each contain the ferromagnetic metal element and that are different in constituent elements or a content ratio of constituent elements; and an oxide phase. At least one of the plurality of non-magnetic phases is more finely interdispersed with the oxide phase than the magnetic phase.

First claim

Opening claim text (preview).

The invention claimed is: 1. A magnetron sputtering target having a ferromagnetic metal element, the magnetron sputtering target including a sintered body that comprises: a magnetic phase containing the ferromagnetic metal element; a plurality of non-magnetic phases that each contain the ferromagnetic metal element and that are different in constituent elements or a content ratio of constituent elements; and an oxide phase, wherein an average size of at least one of the plurality of non-magnetic phases, which is interspersed with the oxide phase, is smaller than an average size of the magnetic phase. 2. The magnetron sputtering target according to claim 1 , wherein an average size of one of the plurality of non-magnetic phases, which is interspersed with the oxide phase, is smaller than an average size of another of the plurality of non-magnetic phases. 3. The magnetron sputtering target according to claim 1 , wherein the magnetic phase has an average phase size of 40 μm or larger and 80 μm or smaller. 4. The magnetron sputtering target according to claim 1 , wherein the plurality of non-magnetic phases are two non-magnetic phases. 5. The magnetron sputtering target according to claim 1 , wherein the ferromagnetic metal element is Co. 6. The magnetron sputtering target according to claim 5 , wherein the magnetic phase is a Co—Cr alloy phase in which the ratio of an amount of Co is 85 at % or more. 7. The magnetron sputtering target according to claim 5 , wherein the magnetic phase is composed only of Co. 8. The magnetron sputtering target according to claim 5 , wherein at least one of the non-magnetic phases is a Co—Cr alloy phase in which the ratio of an amount of Co is more than 0 at % and 75 at % or less or a Co—Cr—Pt alloy phase in which the ratio of an amount of Co is more than 0 at % and 73 at % or less. 9. The magnetron sputtering target according to claim 5 , wherein at least one of the non-magnetic phases is a Co—Pt alloy phase in which the ratio of an amount of Co is more than 0 at % and 12 at % or less. 10. The magnetron sputtering target according to claim 1 , wherein the oxide phase contains at least one of SiO 2 , TiO 2 , Ti 2 O 3 , Ta 2 O 5 , Cr 2 O 3 , CoO, Co 3 O 4 , B 2 O 3 , Fe 2 O 3 , CuO, Y 2 O 3 , MgO, Al 2 O 3 , ZrO 2 , Nb 2 O 5 , MoO 3 , CeO 2 , Sm 2 O 3 , Gd 2 O 3 , WO 2 , WO 3 , HfO 2 , and NiO 2 . 11. A manufacturing method of a magnetron sputtering target, the method comprising: mixing and dispersing: (i) a first non-magnetic metal powder containing a ferromagnetic metal element, and (ii) an oxide powder to obtain a non-magnetic powder mixture , wherein the mixing and dispersing is performed with a ball mill until a cumulative rotation number of 1,000,000 or more of the ball mill is reached during the mixing and dispersing; and mixing and dispersing: (i) the obtained non-magnetic powder mixture, (ii) a magnetic metal powder containing the ferromagnetic metal element, and (iii) a second non-magnetic metal powder containing the ferromagnetic metal element, the second non-magnetic metal powder being different in constituent elements or a content ratio of constituent elements from the first non-magnetic metal powder to obtain a powder mixture for pressure sintering, wherein: the mixing and dispersing to obtain the powder mixture for pressure sintering is terminated before each particle size decreases; and the powder mixture for pressure sintering has particle sizes of its respective constituent components so as to provide, in a sintered body made from the powder mixture, an average size of a phase comprising the first non-magnetic metal powder that is smaller than an average size of a phase comprising the magnetic metal powder. 12. A manufacturing method of a magnetron sputtering target, the method comprising: mixing and dispersing: (i) a first non-magnetic metal powder containing a ferromagnetic metal element, and (ii) a first oxide powder to obtain a non-magnetic powder mixture , wherein the mixing and dispersing is performed with a ball mill until a cumulative rotation number of 1,000,000 or more of the ball mill is reached during the mixing and dispersing; and mixing and dispersing: (i) the obtained non-magnetic powder mixture, (ii) a magnetic metal powder containing the ferromagnetic metal element, (iii) a second non-magnetic metal powder containing the ferromagnetic metal element, the second non-magnetic metal powder being different in constituent elements or a content ratio of constituent elements from the first non-magnetic metal powder, and (iv) a second oxide powder, to obtain a powder mixture for pressure sintering, wherein: the mixing and dispersing to obtain the powder mixture for pressure sintering is terminated before each particle size decreases; and the powder mixture for pressure sintering has particle sizes of its respective constituent components so as to provide, in a sintered body made from the powder mixture, an average size of a phase comprising the first non-magnetic metal powder that is smaller than an average size of a phase comprising the magnetic metal powder. 13. The manufacturing method of a magnetron sputtering target according to claim 11 , wherein two types of non-magnetic metal powders are used. 14. The manufacturing method of a magnetron sputtering target according to claim 11 , wherein the ferromagnetic metal element is Co. 15. The manufacturing method of a magnetron sputtering target according to claim 14 , wherein the magnetic metal powder contains Co and Cr as main components, and the ratio of an amount of Co contained in the magnetic metal powder is 85 at % or more. 16. The manufacturing method of a magnetron sputtering target according to claim 14 , wherein the magnetic metal powder is composed only of Co. 17. The manufacturing method of a magnetron sputtering target according to claim 14 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Cr alloy in which the ratio of an amount of Co is more than 0 at % and 75 at % or less or a Co—Cr—Pt alloy in which the ratio of an amount of Co is more than 0 at % and 73 at % or less. 18. The manufacturing method of a magnetron sputtering target according to claim 14 , wherein at least one of the plurality of non-magnetic metal powders is a Co—Pt alloy in which the ratio of an amount of Co is more than 0 at % and 12 at % or less. 19. A magnetron sputtering target obtained by the manufacturing method according to claim 11 . 20. The magnetron sputtering target according to claim 2 , wherein the magnetic phase has an average phase size of 40 μm or larger and 80 μm or smaller. 21. The magnetron sputtering target according to claim 2 , wherein the plurality of non-magnetic phases are two non-magnetic phases. 22. The magnetron sputtering target according to claim 2 , wherein the ferromagnetic metal element is Co. 23. The magnetron sputtering target according to claim 22 , wherein the magnetic phase is a Co—Cr alloy phase in which the ratio of an amount of Co is 85 at % or more. 24. The magnetron sputtering target according to claim 22 , wherein the magnetic phase is composed only of Co. 25. The magnetron sputtering target according to claim 22 , wherein at least one of the non-magnetic phases is a Co—Cr alloy phase in which the ratio of an amount of Co is more than 0 at % and 75 at % or less or a Co—Cr—Pt alloy phase in which the ratio of an amount of Co

Assignees

Inventors

Classifications

  • Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor {; Presses and furnaces} · CPC title

  • Alloys based on chromium · CPC title

  • simultaneously · CPC title

  • Alloys based on a platinum group metal · CPC title

  • Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9502224B2 cover?
Provided is a magnetron sputtering target having a ferromagnetic metal element. This magnetron sputtering target includes: a magnetic phase containing the ferromagnetic metal element; a plurality of non-magnetic phases that each contain the ferromagnetic metal element and that are different in constituent elements or a content ratio of constituent elements; and an oxide phase. At least one of t…
Who is the assignee on this patent?
Tanaka Precious Metal Ind
What technology area does this patent fall under?
Primary CPC classification H01J37/3429. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).