Adjustable heat sink fin spacing

Patent metadata

Field	Value
Publication number	US-9921008-B2
Application number	US-201715499417-A
Country	US
Kind code	B2
Filing date	Apr 27, 2017
Priority date	Apr 18, 2016
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A heat sink includes a heat sink base, a first fin, and a second fin. The spacing between the base and the first fin and the second fin, restively, may be adjusted by rotating a threaded rod. The threaded rod includes a first threaded knurl that is engaged with the first fin and a second threaded knurl that is engaged with the second fin. The thread pitch of the first threaded knurl and the second threaded knurl may differ. For example, the pitch of the first threaded knurl may be smaller than the pitch of the second threaded knurl if the first fin is located nearest the heat sink base relative to the second fin. The spacing of the heat sink fins may be adjusted based upon the current operating conditions of the electronic device to maintain an optimal temperature of a heat generating device during device operation.

First claim

What is claimed is:

1. A heat sink comprising:
a heat sink base comprising an underside and a topside;
a first heat sink fin comprising a first threaded opening;
a second heat sink fin comprising a second threaded opening, the first heat sink fin located nearest the heat sink base relative to the second heat sink fin; and
a threaded rod comprising a first threaded knurl comprising first threads of a first thread pitch that engage with threads of the first threaded opening and a second threaded knurl comprising second threads of a second thread pitch that engage with threads of the second threaded opening.

2. The heat sink of claim 1 , further comprising a motor that rotates the threaded rod about an axis orthogonal to the topside of the heat sink base.

3. The heat sink of claim 2 , wherein upon the rotation of the threaded rod, the first fin is displaced against the first threaded knurl by a first dimension along the axis and the second fin is displaced against the second threaded knurl by a second dimension along the axis.

4. The heat sink of claim 3 , wherein the first thread pitch is smaller than the second thread pitch and wherein the first dimension is smaller than the second dimension.

5. The heat sink of claim 1 , wherein rotation of the first heat sink fin and rotation the second heat sink fin is fixed relative to the heat sink base.

6. The heat sink of claim 1 , further comprising:
a first fin temperature sensing device that measures temperature of the first heat sink fin.

7. The heat sink of claim 6 , further comprising:
a second fin temperature sensing device that measures temperature of the second heat sink fin.

8. The heat sink of claim 1 , further comprising:
a temperature sensing device that measures temperature of a heat generating device thermally connected to the underside of the heat sink.

9. A heat sink comprising:
a heat sink base comprising an underside and a topside;
a riser connected to the topside, the riser comprising a sidewall;
a first heat sink fin comprising a first threaded opening;
a second heat sink fin comprising a second threaded opening, the first heat sink fin located nearest the sidewall relative to the second heat sink fin; and
a threaded rod comprising a first threaded knurl comprising first threads of a first thread pitch that engage with threads of the first threaded opening and a second threaded knurl comprising second threads of a second thread pitch that engage with threads of the second threaded opening.

10. The heat sink of claim 9 , further comprising a motor that rotates the threaded rod about an axis parallel to the topside of the heat sink base.

11. The heat sink of claim 10 , wherein upon the rotation of the threaded rod, the first fin is displaced against the first threaded knurl by a first dimension along the axis and the second fin is displaced against the second threaded knurl by a second dimension along the axis.

12. The heat sink of claim 11 , wherein the first thread pitch is smaller than the second thread pitch and wherein the first dimension is smaller than the second dimension.

13. The heat sink of claim 9 , wherein rotation of the first heat sink fin and rotation the second heat sink fin is fixed relative to the riser.

14. The heat sink of claim 9 , further comprising:
a first fin temperature sensing device connected to the first heat sink fin, wherein the first temperature sensing device measures the first heat sink fin temperature.

15. The heat sink of claim 14 , further comprising:
a second fin temperature sensing device connected to the second heat sink fin, wherein the second temperature sensing device measures the second heat sink fin temperature.

16. The heat sink of claim 9 , further comprising:
a temperature sensing device that measures temperature of a heat generating device thermally connected to the underside of the heat sink.

Assignees

• IBM

Inventors

• Bodenweber Paul F
• Sikka Kamal K

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/237

  attached to additional arrangements for cooling · CPC title