Method of making metal substrates with structures formed therein
US-2024404922-A1 · Dec 5, 2024 · US
Stacked semiconductor package
US9214403B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214403-B2 |
| Application number | US-201313896472-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 17, 2013 |
| Priority date | Jan 20, 2010 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat sink and the at least one thermal via and the heat sink may be disposed under the first semiconductor chip with the heat sink being disposed between the first surface and the second surface. The second printed circuit board may include a third surface upon which a second semiconductor chip is mounted. The second printed circuit board may be disposed under the first printed circuit board with the at least one connecting structure connecting the first printed circuit board to the second printed circuit board.
First claim
Opening claim text (preview).
What is claimed is: 1. A stacked semiconductor package comprising: a first printed circuit board including a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached, the first printed circuit board further including a heat sink, the heat sink being disposed under the first semiconductor chip, wherein the first semiconductor chip and the first printed circuit board are electrically connected; a…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9214403B2 cover?
- A stacked semiconductor package including a first printed circuit board and a second printed circuit board is provided. The first printed circuit board may include a first surface upon which a first semiconductor chip is mounted and a second surface upon which at least one connecting structure is attached. The first printed circuit board may further include at least one thermal via and a heat s…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W40/228. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).