Microelectronic component arrangement and production method for a microelectronic component arrangement

Patent metadata

Field	Value
Publication number	US-9919912-B2
Application number	US-201615273772-A
Country	US
Kind code	B2
Filing date	Sep 23, 2016
Priority date	Sep 24, 2015
Publication date	Mar 20, 2018
Grant date	Mar 20, 2018

Abstract

A microelectronic component arrangement includes a sensor and a carrier. The sensor has a detection surface and a region including contact elements situated at a first distance with respect to one another. The carrier includes a mounting surface, and the sensor is fixed on the carrier by the contact elements situated at a first distance with respect to one another at least regionally. The detection surface is opposite the mounting surface in a manner having a second distance with respect to the mounting surface. The contact elements are wetted by a mechanically stabilizing material, the region including the contact elements is enclosed by the mechanically stabilizing material, and the detection surface is free of the mechanically stabilizing material.

First claim

What is claimed is:

1. A microelectronic component arrangement comprising:
a carrier including a mounting surface; and
a sensor, including:
at least one detection surface;
a plurality of contact elements that (i) are distributed over a first region of the sensor and over at least one further region of the sensor such that adjacent contact elements within each region are spaced apart from each other by a first distance, and (ii) at least regionally fix the sensor on the carrier such that the at least one detection surface is opposite the mounting surface at a second distance, wherein
the first distance is less than or equal to the second distance;
the first distance is between 10 micrometers and 30 micrometers; and
the second distance is between 30 micrometers and 100 micrometers; and

a mechanically stabilizing material that encloses the first region and the at least one further region such that the plurality of contacts are wetted by the mechanically stabilizing material, and such that the at least one detection surface is free of the mechanically stabilizing material.

2. The microelectronic component arrangement as claimed in claim 1 , wherein:
at least one access to the detection surface is present between the at least one detection surface and the mounting surface, and
the at least one access is free of the mechanically stabilizing material.

3. The microelectronic component arrangement as claimed in claim 1 , wherein:
adjacent regions of the sensor are spaced apart from each other by a third distance; and
the third distance is at least 100 micrometers.

4. The microelectronic component arrangement as claimed in claim 3 , wherein:
a ratio between the second distance and the first distance is greater than two,
a ratio between the third distance and the second distance is greater than one, and
a ratio between the third distance and the first distance is greater than three.

5. The microelectronic component arrangement as claimed in claim 1 , wherein:
each of the contact elements comprises at least one of solder balls, solder bumps, and solder pillars.

6. The microelectronic component arrangement as claimed in claim 1 , wherein:
the mechanically stabilizing material comprises an underfill material.

7. The microelectronic component arrangement as claimed in claim 1 , wherein:
the sensor comprises a circuit.

8. The microelectronic component arrangement as claimed in claim 1 , wherein:
further solder balls are formed at least regionally on a side of the carrier facing away from the mounting surface.

9. A method for producing a microelectronic component arrangement, comprising:
providing a sensor having a first surface, a second surface opposite the first surface, and at least one side surface, the first surface including at least one detection surface and at least two regions including contact elements that are situated at a first distance with respect to one another, wherein the first distance is between 10 micrometers and 30 micrometers;
providing a carrier comprising a mounting surface;
connecting the sensor to the mounting surface by the contact elements of the at least one region, a second distance being set between the at least one detection surface and the mounting surface,
wherein the first distance less than or equal to the second distance, and
wherein the second distance between 30 micrometers and 100 micrometers; and

stabilizing the connection by a mechanically stabilizing material,
wherein the contact elements are wetted with the mechanically stabilizing material by capillary forces,
wherein the at least two regions are enclosed by the mechanically stabilizing material, and
wherein the detection surface is kept free of the mechanically stabilizing material by the capillary forces.

10. The method as claimed in claim 9 , further comprising keeping the mechanically stabilizing material between the contact elements by a surface tension that forms.

11. The method as claimed in claim 9 , wherein the first surface comprises an access to the detection surface and the access is kept free of the mechanically stabilizing material by the capillary forces.

12. A microelectronic component arrangement comprising:
a carrier including a mounting surface; and
a sensor including:
a detection surface;
a contact surface that has:
a first material region; and
at least one further material region;
wherein adjacent material regions are spaced apart from each other by a first distance;

a plurality of contact elements that fix the contact surface of the sensor to the mounting surface of the carrier such that the detection surface is opposite the mounting surface at a second distance, the plurality of contact element including:
a first set of at least two contact elements that are distributed over the first material region such that adjacent contact elements are spaced apart by a third distance; and
at least one further set of at least two contact elements that are distributed over the at least one further material region such that adjacent contact elements are spaced apart by the third distance; and

a mechanically stabilizing material that encloses the plurality of contact elements, the third distance sized such that:
(i) adjacent contact elements within each material region are configured to draw the mechanical stabilizing material, in liquid form, into space therebetween via capillary action; and
(ii) a surface tension of the mechanically stabilizing material, in liquid form, prevents the mechanically stabilizing material from filling the first distance between adjacent material regions, the first distance between adjacent material regions forming at least one access to the detection surface between the sensor and the carrier that is free of the mechanically stabilizing material.

13. The microelectronic component arrangement as claimed in claim 12 , wherein:
each of the contact elements includes at least one of a solder ball, a solder bump, and a solder pillar.

14. The microelectronic component arrangement as claimed in claim 12 , wherein:
the mechanically stabilizing material includes an underfill material.

15. The microelectronic component arrangement as claimed in claim 12 , wherein:
the sensor includes a circuit.

16. The microelectronic component arrangement as claimed in claim 1 , further comprising a plurality of solder balls positioned, at least regionally on a side of the carrier facing away from the mounting surface.

Assignees

• Bosch Gmbh Robert

Inventors

• Ante Frederik
• Amberger Maximilian

Classifications

• B81C2203/035

  Soldering · CPC title

• B81C2203/032

  Gluing · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81C1/00269

  Bonding of solid lids or wafers to the substrate · CPC title

• B81B2207/012

  the micromechanical device and the control or processing electronics being separate parts in the same package · CPC title