Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof

Patent metadata

Field	Value
Publication number	US-9918384-B2
Application number	US-201414329187-A
Country	US
Kind code	B2
Filing date	Jul 11, 2014
Priority date	Mar 4, 2010
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

First claim

What is claimed is:

1. A bond ply, comprising
a first outer layer comprising a thermosetting composition and a filler composition;
a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and
an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and 10 to 60 volume percent of a filler composition that is of the same type as the first and second outer layers;
wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers; and
wherein the bond ply does not include glass or other fabric.

2. The bond ply of claim 1 , wherein the thermosetting composition comprises an epoxy, polybutadiene, polyisoprene, polyimide, or a combination comprising at least one of the foregoing.

3. The bond ply of claim 2 , wherein the thermosetting composition passes UL94 V0 testing in the absence of halogenated flame retardants.

4. The bond ply of claim 1 , wherein the thermosetting composition comprises:
a poly(arylene ether) component; and
a carboxy-functionalized polybutadiene or polyisoprene polymer component.

5. The bond ply of claim 1 , wherein the thermosetting composition comprises:
a cure system; and
a component of solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system.

6. The bond ply of claim 1 , wherein an amount of the filler composition in each layer of the bond ply is the same and a ratio of components in the thermosetting composition of each layer is different.

7. The bond ply of claim 1 , wherein an amount of the filler composition in the intermediate layer is equal to an amount of filler in the first and second outer layers.

8. The bond ply of claim 1 , wherein an amount of the filler composition in the intermediate layer is different than an amount of filler in the first and second outer layers.

9. The bond ply of claim 8 , wherein the amount of the filler composition in each outer layer is different.

10. The bond ply of claim 1 , wherein the filler composition comprises at least one of silica, titania, magnesium hydroxide, strontium titanate, barium titanate, Ba 2 Ti 9 O 20 , boron nitride, aluminum nitride, and alumina.

11. The bond ply of claim 1 , wherein a thickness of each outer layer is different.

12. The bond ply of claim 11 , wherein a thickness of the intermediate layer is different than the thickness of the outer layers.

13. The bond ply of claim 1 , wherein the filler composition is present in an amount of up to 50 volume percent of each thermosetting composition.

14. The bond ply of claim 1 , wherein the intermediate layer is fully cured.

15. The bond ply of claim 1 , wherein the first and second out layers are uncured.

16. The bond ply of claim 1 , wherein the first and second out layers are partially cured.

17. A method of making a bond ply, comprising:
forming an intermediate layer comprising a thermosetting composition and 10 to 60 volume percent of a filler composition;
curing the thermosetting composition of the intermediate layer to a first degree;
coating a first outer layer comprising a thermosetting composition and a filler composition that is of the same type as the intermediate layer onto a surface of the intermediate layer; and
coating a second outer layer comprising a thermosetting composition and a filler that is of the same type as the intermediate layer and the first outer layer onto a surface of the intermediate layer opposite the first layer;
wherein the bond ply does not include glass or other fabric.

18. The method of claim 17 , further comprising B-staging the thermosetting compositions of the first and second outer layers.

19. A method of making a circuit subassembly, comprising:
disposing a bond ply between a patterned conductive layer and another conductive layer, a release layer, or a polymeric dielectric substrate layer to form a subassembly, wherein the bond ply comprises
a first outer layer comprising a thermosetting composition and a filler composition;
a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and
an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and 10 to 60 volume percent of filler composition that is of the same type as the first and second outer layers,
wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers; and

laminating the subassembly;
wherein the bond ply does not include glass or other fabric.

20. The method of claim 19 , wherein the bond ply is disposed on the release layer and the method further comprises removing the release layer from a surface of the bond ply opposite the core laminate after laminating the subassembly; and metalizing the laminated subassembly on the surface of the bond ply.

Assignees

• Rogers Corp

Inventors

• Baars Dirk M
• Doyle Dale J
• Paul Sankar J
• Williams Diana J
• Barton Carlos L

Classifications

• H05K1/00

  Printed circuits · CPC title

• Y10T428/2826

  Synthetic resin or polymer · CPC title

• Y10T428/2495

  Thickness [relative or absolute] · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• B05D5/12

  to obtain a coating with specific electrical properties · CPC title