Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
US-9918384-B2 · Mar 13, 2018 · US
Baars Dirk M is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Baars Dirk M |
| Total patents | 2 |
| First publication | Feb 16, 2016 |
| Latest publication | Mar 13, 2018 |
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Rogers Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B27/38 | 2 |
| H05K2201/0133 | 2 |
| H05K3/4626 | 2 |
| H05K3/462 | 2 |
| B32B2457/08 | 2 |