Light-emitting device and electronic device

US9088006B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9088006-B2
Application numberUS-201313886474-A
CountryUS
Kind codeB2
Filing dateMay 3, 2013
Priority dateMay 9, 2012
Publication dateJul 21, 2015
Grant dateJul 21, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A light-emitting device includes a light-emitting element between two substrates, a terminal portion which includes at least two terminals and is electrically connected to the light-emitting element, and an adhesive layer between the two substrates. A substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.

First claim

Opening claim text (preview).

What is claimed is: 1. A light-emitting device comprising: a first substrate; a second substrate facing the first substrate; a light-emitting element between the first substrate and the second substrate; a third substrate partly overlapping with the first substrate; a terminal portion electrically connected to the light-emitting element and over the third substrate, the terminal portion comprising at least two terminals; and an adhesive layer between the first substrate and the second substrate, wherein a coefficient of thermal expansion of the third substrate is 10 ppm/K or lower. 2. The light-emitting device according to claim 1 , wherein the adhesive layer is in contact with the third substrate. 3. The light-emitting device according to claim 1 , wherein the third substrate does not overlap with the light-emitting element. 4. The light-emitting device according to claim 1 , wherein an absolute value of a difference between a first coefficient of thermal expansion of the first substrate and a second coefficient of thermal expansion of the second substrate is within 10% of the first coefficient of thermal expansion or within 10% of the second coefficient of thermal expansion. 5. An electronic device comprising the light-emitting device according to claim 4 in a display portion. 6. A light-emitting device comprising: a first substrate; a second substrate facing the first substrate, the second substrate overlapping with a region of the first substrate; a light-emitting element between the first substrate and the second substrate; a terminal portion electrically connected to the light-emitting element and over an outer region of the region of the first substrate, the terminal portion comprising at least two terminals; and an adhesive layer between the first substrate and the second substrate, wherein a coefficient of thermal expansion of the first substrate is 10 ppm/K or lower. 7. The light-emitting device according to claim 6 , wherein an absolute value of a difference between a first coefficient of thermal expansion of the first substrate and a second coefficient of thermal expansion of the second substrate is within 10% of the first coefficient of thermal expansion or within 10% of the second coefficient of thermal expansion. 8. The light-emitting device according to claim 6 , wherein an FPC is electrically connected to the terminal portion though an anisotropic conductive layer. 9. An electronic device comprising the light-emitting device according to claim 6 in a display portion.

Assignees

Inventors

Classifications

  • Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

  • Organic light-emitting transistors · CPC title

  • Organic PV cells · CPC title

  • comprising light absorbing layers, e.g. black layers · CPC title

  • Encapsulations · CPC title

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Frequently asked questions

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What does patent US9088006B2 cover?
A light-emitting device includes a light-emitting element between two substrates, a terminal portion which includes at least two terminals and is electrically connected to the light-emitting element, and an adhesive layer between the two substrates. A substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected t…
Who is the assignee on this patent?
Semiconductor Energy Lab
What technology area does this patent fall under?
Primary CPC classification H10K59/8722. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 21 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).