Methods and apparatus for controlling photoresist line width roughness with enhanced electron spin control

Patent metadata

Field	Value
Publication number	US-9911582-B2
Application number	US-201514939787-A
Country	US
Kind code	B2
Filing date	Nov 12, 2015
Priority date	Jun 15, 2011
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

The present disclosure provides methods and an apparatus for controlling and modifying line width roughness (LWR) of a photoresist layer with enhanced electron spinning control. In one embodiment, an apparatus for controlling a line width roughness of a photoresist layer disposed on a substrate includes a processing chamber having a chamber body having a top wall, side wall and a bottom wall defining an interior processing region, a support pedestal disposed in the interior processing region of the processing chamber, and a plasma generator source disposed in the processing chamber operable to provide predominantly an electron beam source to the interior processing region.

First claim

What is claimed is:

1. A method for controlling line width roughness of a photoresist layer disposed on a substrate comprising:
providing a substrate having a patterned photoresist layer disposed thereon into a processing chamber;
supplying a gas mixture into the processing chamber;
generating an electron beam from the gas mixture having electrons moving in a circular mode from the gas mixture;
generating a magnetic field to enhance spinning of electrons in the electron beam moving in the circular mode to a substrate surface;
filtering ions from the electron beam by passing the ions through a plate, wherein the plate has at least two zones having different dielectric constants or different potential bias; and
trimming an edge profile of the patterned photoresist layer disposed on the substrate surface with the enhanced electrons.

2. The method of claim 1 , further comprising:
directing the filtered electrons through the magnetic field.

3. The method of claim 1 , wherein generating the magnetic field further comprising:
applying a DC or AC power to one or more electromagnetic coils disposed around an outer circumference of the processing chamber.

4. The method of claim 1 , wherein the gas mixture comprises an oxygen containing gas.

5. A method for controlling line width roughness of a photoresist layer disposed on a substrate comprising:
supplying a gas mixture into a processing chamber having a substrate disposed therein, wherein the substrate has a patterned photoresist layer disposed thereon;
generating an electron beam in the processing chamber from the gas mixture supplied in the processing chamber;
applying a voltage to a shield plate disposed in the processing chamber to filter ions from the electron beam;
directing the electron beam through a control plate;
filtering ions from the electron beam by gassing the ions through the control plate, wherein the control plate has at least two zones having different dielectric constants or different potential bias;
applying a DC or AC power to a group of one or more electromagnetic coils disposed around an outer circumference of the processing chamber to generate a magnetic field;
enhancing movement of the electron beam in circular mode by passing through the filtered electron beam in the magnetic field; and
rotating the electron beam to trim an edge profile of the patterned photoresist layer using the electron beam.

6. The method of claim 5 , wherein directing the electron beam further comprises:
applying a power to the control plate.

7. The method of claim 5 , wherein supplying the gas mixture further comprises:
supplying an oxygen containing gas into the processing chamber.

8. The method of claim 5 , wherein the filtered electron beam include neutral radicals and electrons.

Assignees

• Applied Materials Inc

Inventors

• Wu Banqiu
• Kumar Ajay
• Ramaswamy Kartik
• Nalamasu Omkaram

Classifications

• H10P76/204

  of organic photoresist masks · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H01J37/3244

  Gas supply means · CPC title

• H01J37/32009

  Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources (plasma generation in general H05H1/24) · CPC title

• H01J37/32422

  Arrangement for selecting ions or species in the plasma · CPC title