Three-dimensional texturing of two-dimensional materials

Patent metadata

Field	Value
Publication number	US-9908285-B2
Application number	US-201514716303-A
Country	US
Kind code	B2
Filing date	May 19, 2015
Priority date	May 21, 2014
Publication date	Mar 6, 2018
Grant date	Mar 6, 2018

Abstract

A method of creating crumples in a monolayer entails contacting a monolayer comprising a two-dimensional material with a thermally contractible polymer, and heating the thermally contractible polymer to contract the polymer and induce buckling of the monolayer, where a plurality of crumples are formed in the monolayer due to the buckling. A device having a crumpled microstructure includes a monolayer comprising a two-dimensional material and including a plurality of crumples.

First claim

The invention claimed is:

1. A method comprising:
contacting a monolayer comprising a two-dimensional material with a thermally contractible polymer;
heating the thermally contractible polymer to contract the polymer and induce buckling of the monolayer contacted therewith, a plurality of crumples being formed in the monolayer due to the buckling, the monolayer thereby comprising a crumpled morphology; and
after the heating of the thermally contractible polymer, transferring the monolayer from the thermally contractible polymer to another substrate while preserving the crumpled morphology, the other substrate thereby including the monolayer comprising the crumpled morphology.

2. The method of claim 1 , wherein the heating occurs at a temperature in the range of from about T g ±0.2T g , where T g is a glass transition temperature of the thermally contractible polymer, and wherein the heating is carried out for a time duration of from about 20 seconds to 24 hours.

3. The method of claim 1 , wherein the heating of the thermally contractible polymer comprises localized heating of one or more portions of the polymer, the localized heating inducing the buckling at one or more regions of the monolayer in contact with the one or more portions, and
wherein the plurality of crumples are formed only in the one or more regions of the monolayer, other regions of the monolayer remaining uncrumpled.

4. The method of claim 3 , wherein the localized heating is carried out using an infrared radiation source.

5. The method of claim 1 , wherein the contracting of the thermally contractible polymer is in an amount L−L 0 corresponding to a compressive strain of from about 1% to about 1000%, wherein L 0 and L are linear dimensions of the thermally contractible polymer before and after the heating, respectively.

6. The method of claim 5 , wherein the compressive strain is from about 1% to about 80%.

7. The method of claim 1 , wherein contacting the monolayer with the thermally contractible polymer comprises transferring, in a solution, the monolayer to the thermally contractible polymer.

8. The method of claim 1 , wherein, prior to contacting the monolayer with the thermally contractible polymer, the monolayer is formed on a substrate by vapor deposition, and the substrate is then removed by etching.

9. The method of claim 1 , wherein during the heating, the thermally contractible polymer is constrained at two opposing ends to induce uniaxial contraction.

10. The method of claim 1 , wherein the two-dimensional material is selected from the group consisting of: graphene, boron nitride, silicene, germanane, and a chalcogenide represented by MX 2 , where M is a transition metal atom and X is a chalcogen atom, and
wherein the thermally contractible polymer comprises a thermoplastic polymer.

11. The method of claim 1 , whereby the monolayer is provided as a stack of monolayers, the method comprising:
contacting the stack of the monolayers with the thermally contractible polymer;
heating the thermally contractible polymer to contract the polymer and induce buckling of the stack contacted therewith, the plurality of crumples being formed in the stack due to the buckling, the stack thereby comprising the crumpled morphology; and
after the heating of the thermally contractible polymer, transferring the stack from the thermally contractible polymer to the other substrate while preserving the crumpled morphology, the other substrate thereby including the stack comprising the crumpled morphology.

12. The method of claim 1 , wherein the transferring further comprises removing the thermally contractible polymer using a solvent treatment.

13. The method of claim 1 , wherein transferring the monolayer comprises a solution-based transfer process.

Assignees

• Univ Illinois

Inventors

• Nam Sungwoo
• Wang Cai Mike

Classifications

• H10P95/906

  for altering the shape of semiconductors, e.g. smoothing the surface · CPC title

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• B29C65/66

  by liberation of internal stresses, e.g. shrinking of one of the parts to be joined · CPC title

• C01B32/194

  After-treatment · CPC title

• B29C66/73715

  heat-shrinkable · CPC title