Light emitting device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-9905741-B2
Application number	US-201414191604-A
Country	US
Kind code	B2
Filing date	Feb 27, 2014
Priority date	Feb 28, 2013
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

The light emitting device including: a flexible substrate having a negative lead electrode and a positive lead electrode formed on an upper surface thereof; a light emitting element having a negative electrode and a positive electrode formed on an upper surface thereof; an insulating film formed on a side surface of the light emitting element; a wiring formed in contact with the insulating film for connecting between the negative electrode and the negative lead electrode, or between the positive electrode and the positive lead electrode.

First claim

The invention claimed is:

1. A light emitting device comprising:
a flexible substrate having a negative lead electrode and a positive lead electrode formed on an upper surface thereof;
a light emitting element having a negative electrode and a positive electrode formed on an upper surface thereof, the light emitting element being bonded to the positive lead electrode by an insulating bonding member;
an insulating film formed in contact with side surfaces of the light emitting element;
a first electrically conductive film formed in contact with a first portion of the insulating film and connecting the negative electrode to the negative lead electrode, a portion of the first electrically conductive film being disposed on an upper surface of the negative electrode of the light emitting element; and
a second electrically conductive film formed in contact with a second portion of the insulating film and connecting the positive electrode to the positive lead electrode, a portion of the second electrically conductive film being disposed on an upper surface of the positive electrode of the light emitting element;
wherein the insulating bonding member covers an end surface of the positive electrode.

2. The light emitting device according to claim 1 , wherein the insulating film is formed on the side surfaces of the light emitting element in an approximately uniform thickness.

3. The light emitting device according to claim 1 ,
wherein a connecting portion between the first electrically conductive film and the negative lead electrode is positioned in a vicinity of a lower end of a first side surface of the light emitting element, and
wherein a connecting portion between the second electrically conductive film and the positive lead electrode is positioned in a vicinity of a lower end of a second side surface of the light emitting element.

4. The light emitting device according to claim 1 , wherein the insulating film is formed of a translucent inorganic insulating material.

5. The light emitting device according to claim 1 , wherein the insulating film is made of a multi-layer film formed by alternately stacking two kinds of dielectric films with different refractive indexes.

6. A light emitting device comprising:
a flexible substrate;
a negative lead electrode formed on an upper surface of the flexible substrate, the negative lead electrode comprising a first coupling portion and a plurality of first extending electrodes, each having one end thereof coupled to the first coupling portion;
a positive lead electrode formed on an upper surface of the flexible substrate, the positive lead electrode comprising a second coupling portion and a plurality of second extending electrodes, each having one end thereof coupled to the second coupling portion, the second extending electrode being positioned adjacent to the first extending electrode with a predetermined distance therebetween;
a plurality of light emitting elements, each having a positive electrode and a negative electrode on an upper surface thereof, each negative electrode being connected to a first extending electrode, and each positive electrode being connected to a second extending electrode;
an insulating film formed on side surfaces of each of the light emitting elements;
a first electrically conductive film formed on a first portion of the insulating film of each light emitting element and connecting the negative electrode of each light emitting element to a respective first extending electrode, a portion of the first electrically conductive film being disposed on an upper surface of the negative electrode of each light emitting element; and
a second electrically conductive film formed on a second portion of the insulating film of each light emitting element and connecting the positive electrode of each light emitting element to a respective second extending electrode, a portion of the second electrically conductive film being disposed on an upper surface of the positive electrode of each light emitting element,
wherein each light emitting element is bonded to a respective second extending electrode by an insulating bonding member, each insulating bonding member covering an end surface of the respective second extending electrode, and
wherein the first extending electrodes and the second extending electrodes are alternately arranged.

7. The light emitting device according to claim 6 , wherein the flexible substrate has a rectangular shape having a short side and a long side, and the light emitting elements are arranged in a row in a direction along the long side of the flexible substrate.

8. The light emitting device according to claim 6 , wherein, in each of the light emitting elements, the insulating film is formed on the side surfaces of the light emitting element in an approximately uniform thickness.

9. The light emitting device according to claim 6 ,
wherein, in each of the light emitting elements, a connecting portion between the first electrically conductive film and the negative lead electrode is positioned in a vicinity of a lower end of a first side surface of the light emitting element, and
wherein, in each of the light emitting elements, a connecting portion between the second electrically conductive film and the positive lead electrode is positioned in a vicinity of a lower end of a second side surface of the light emitting element.

10. The light emitting device according to claim 6 , wherein the insulating film of each of the light emitting elements is formed of a translucent inorganic insulating material.

11. The light emitting device according to claim 6 , wherein the insulating film of each of the light emitting elements is made of a multi-layer film formed by alternately stacking two kinds of dielectric films with different refractive indexes.

12. The light emitting device according to claim 6 , wherein, in each of the light emitting elements, a thickness of the first and second electrically conductive films is in a range of about 10 to 20 μm.

13. The light emitting device according to claim 6 , where an entirety of each of the first extending electrodes extends linearly inward from the first coupling portion, and an entirety of each of the second extending electrodes extends linearly inward from the second coupling portion.

14. The light emitting device according to claim 6 , wherein the first extending electrodes and the second extending electrodes are alternately arranged such that longitudinal sides of the first extending electrodes are adjacent to longitudinal sides of the second extending electrodes.

15. A light emitting device comprising:
a substrate;
a negative lead electrode formed on an upper surface of the substrate, the negative lead electrode including a first coupling portion and a plurality of first extending electrodes, each having one end thereof coupled to the first coupling portion;
a positive lead electrode formed on an upper surface of the substrate, the positive lead electrode including a second coupling portion and a plurality of second extending electrodes, each having one end thereof coupled to the second coupling portion, the second extending electrodes being positioned adjacent to the first extending electrodes with a predetermined distance therebetween;
a plurality of light emitting elements each having a positive electrode and a negative electrode on an upper surface thereof, each light emitting element being bonded to a respective second extending electrode by an insulating bonding member, each insulating bonding member covering an end surface of the respective second extending electrode;
an insulating f

Assignees

• Nichia Corp

Inventors

• Oyu Takahiro

Classifications

• H10W72/874

  On different surfaces · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/60 Primary

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title