Wafer processing base

Patent metadata

Field	Value
Publication number	US-9905450-B2
Application number	US-201113316264-A
Country	US
Kind code	B2
Filing date	Dec 9, 2011
Priority date	Jun 15, 2009
Publication date	Feb 27, 2018
Grant date	Feb 27, 2018

Abstract

Provided is a substrate for processing a wafer. The present invention can provide a substrate having excellent heat resistance and dimensional stability. The present invention can provide a substrate that has excellent stress relaxation properties, and therefore can prevent a wafer from being destroyed due to residual stress. Also, the present invention can provide a substrate that can prevent a wafer from being damaged or fried off due to a non-uniformly applied pressure during the wafer processing process, and that exhibits excellent cuttability. For these reasons, the substrate can be useful as a sheet for processing a wafer in various wafer preparation processes such as dicing, back-grinding, and picking-up.

First claim

That which is claimed:

1. A pressure-sensitive adhesive sheet for processing a wafer, comprising:
a heat resistant substrate that is a photo-cured product of a photo-curable composition, and
a pressure-sensitive adhesive layer formed on one or both sides of the substrate and coming in contact with the substrate,
wherein the photo-curable composition comprises a high-molecular weight acrylic polymer and a monomer component,
wherein the substrate has a glass transition temperature of −20° C. to 45° C. and a toughness of 10 kg·mm to 250 kg·mm at 23° C.,
wherein the high-molecular weight acrylic polymer comprises a partially polymerized product of a monomer mixture including:
(a) an alkyl(meth)acrylate having an alkyl group having 1 to 14 carbon atoms;
(b) at least one selected from the group consisting of a (meth)acrylate having an alkoxy group; a (meth)acrylate having a alicyclic group; a (meth)acrylate having an aromatic group; and a (meth)acrylate having a heterocyclic moiety; and
(c) a monomer having a hydroxyl group, carboxyl group, nitrogen-containing group or glycidyl group, and

wherein the monomer mixture does not include urethane acrylate.

2. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the substrate has a glass transition temperature of −10° C. to 40° C.

3. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the substrate has a toughness of 10 kg·mm to 200 kg·mm at 23° C.

4. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the substrate has a toughness of 10 kg·mm to 250 kg·mm at 20° C. to 25° C.

5. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the high-molecular weight acrylic polymer has an average molecular weight of 500 to 1,000,000.

6. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the photo-curable composition further comprises multi-functional acrylate.

7. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the photo-curable composition further comprises a photoinitiator.

8. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the substrate has a thickness of 5 μm to 400 μm.

9. The pressure-sensitive adhesive sheet for processing a wafer according to claim 1 , wherein the pressure-sensitive adhesive layer comprising an acrylic polymer that is cross-linked by a multi-functional cross-linking agent.

Assignees

• Kim Se Ra
• Joo Hyo Sook
• Chang Suk Ky
• Shim Jung Sup
• Lg Chemical Ltd

Inventors

• Kim Se Ra
• Joo Hyo Sook
• Chang Suk Ky
• Shim Jung Sup

Classifications

• H10P72/7422

  used to protect an active side of a device or wafer · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• C09J175/16

  having terminal carbon-to-carbon unsaturated bonds · CPC title

• C08L33/08

  Homopolymers or copolymers of acrylic acid esters · CPC title