Optoelectronic package

Patent metadata

Field	Value
Publication number	US-9899794-B2
Application number	US-201414319696-A
Country	US
Kind code	B2
Filing date	Jun 30, 2014
Priority date	Jun 30, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A optoelectronic package includes an inner package with a dielectric substrate having at least a first dielectric level with a photodetector (PD) die on a die attach area, first routing connecting a first contact to a first external bond pad (FEBP), and second routing connecting a second contact to a second external bond pad (SEBP). An outer package (OP) includes a ceramic substrate including a light source die on a base portion in direct line of sight with the PD including a first electrode and second electrode. A first wire bond connects the FEBP to a first terminal, a second wire bond connects the SEBP to a second terminal, a third wire bond connects the first electrode to a third terminal, and a fourth wire bond connects the second electrode to a fourth terminal.

First claim

The invention claimed is:

1. An optoelectronic package, comprising:
an inner package including a first dielectric substrate including at least a first dielectric level having a photodetector (PD) die inside said inner package on a die attach area including a first contact and a second contact, first routing connecting said first contact to a first external bond pad (FEBP) and second routing connecting said second contact to a second external bond pad (SEBP);
said inner package inside an outer package (OP) including a second ceramic substrate including a base portion, at least one light source die including a first electrode and second electrode on said base portion positioned to face said PD die to be in a direct line of sight with an emitting area of said light source die;
a first wire bond connecting said FEBP to a first terminal of said OP, a second wire bond connecting said SEBP to a second terminal of said OP, a third wire bond connecting said first electrode to a third terminal of said OP, and a fourth wire bond connecting said second electrode to a fourth terminal of said OP; and
a cavity die on the light source die and touching the photo detector die.

2. The optoelectronic package of claim 1 , wherein said first contact is a front contact connected to said FEBP an internal bond wire and said second contact is connected by a back side metal layer to said second external bond pad.

3. The optoelectronic package of claim 1 , wherein said first contact is a first front contact connected to said FEBP by a first internal bond wire and said second contact is a second front contact connected by a second internal bond wire to said SEBP.

4. The optoelectronic package of claim 1 , where said first contact is a front contact connected to said FEBP by a through-silicon via (TSV) connected to a first back side metal portion and said second contact is a back contact connected to said SEBP.

5. The optoelectronic package of claim 1 , wherein said light source die comprises a laser diode.

6. An optoelectronic package, comprising:
a first package including a photo detector die attached to a first substrate, the photo detector die including a first external bond pad and a second external bond pad;
a second package including a light source die attached to a second substrate, the first package inside the second package, the light source die including a first electrode and a second electrode; and
a cavity die on the light source die and touching the photo detector die.

7. The optoelectronic package of claim 6 , wherein the photo detector die and the light source die have a direct line of sight via a cavity of the cavity die.

8. The optoelectronic package of claim 6 , wherein the cavity die is on the light source die in between the first electrode and the second electrode.

9. The optoelectronic package of claim 6 , wherein the first external bond pad is electrically coupled to a first terminal of the second package via a first wire bond and the second external bond pad is electrically coupled to a second terminal of the second package via a second wire bond.

10. The optoelectronic package of claim 9 , wherein the first electrode is electrically coupled to a third terminal of the second package via a third wire bond and the second electrode is electrically coupled to a fourth terminal of the second package via a fourth wire bond.

11. The optoelectronic package of claim 6 , wherein said light source die comprises a laser diode.

Assignees

• Texas Instruments Inc

Inventors

• Wong Will Kiang
• Parsa Roozbeh
• French William
• Nakanishi Noboru

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H01L31/167

  Electricity · mapped topic

• H01L31/0203

  Electricity · mapped topic

• H01L31/02002

  Electricity · mapped topic