Optoelectronic package
US-2015380895-A1 · Dec 31, 2015 · US
Optical semiconductor element package and optical semiconductor device
US9106047B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9106047-B2 |
| Application number | US-201213459535-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2012 |
| Priority date | May 10, 2011 |
| Publication date | Aug 11, 2015 |
| Grant date | Aug 11, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.
First claim
Opening claim text (preview).
What is claimed is: 1. An optical semiconductor element package, comprising: a ceramic wiring substrate having a mounting area for mounting an optical semiconductor element, in a center part; an element electrode for connecting the optical semiconductor element, the element electrode provided on the ceramic wiring substrate; an external connection electrode electrically connected to the element electrode, the external connection electrode provided to the ceramic wiring substra…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9106047B2 cover?
- An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate …
- Who is the assignee on this patent?
- Kimura Yasuyuki, Suyama Mikio, Machii Misuzu, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H01S5/02276. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 11 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).