Short-circuit element and a circuit using the same

US9899179B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9899179-B2
Application numberUS-201514818862-A
CountryUS
Kind codeB2
Filing dateAug 5, 2015
Priority dateFeb 5, 2013
Publication dateFeb 20, 2018
Grant dateFeb 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A bypass avoiding only abnormal cells or abnormal electronic components in an electronic appliance having a plurality of battery cells or electronic components is formed to decrease resistance while keeping functionality.

First claim

Opening claim text (preview).

The invention claimed is: 1. A short-circuit element comprising: an insulating substrate; a first and a second heat-generating resistors formed on the insulating substrate; a first and a second electrodes arranged adjacently to each other on the insulating substrate; a third electrode arranged adjacently to the first electrode on the insulating substrate and electrically connected to the first heat-generating resistor; a fourth electrode arranged adjacently to the second electrode on the insulating substrate and electrically connected to the second heat-generating resistor; a fifth electrode arranged adjacently to the fourth electrode; a first meltable conductor arranged between the first and third electrodes to constitute a current path capable of being blown by a heat generated by the first heat-generating resistor; and a second meltable conductor arranged between the second and fifth electrodes through the fourth electrode to constitute a current path, in which the current path between the second and fourth electrodes and between the fourth and fifth electrodes are capable of being blown by a heat generated by the second heat-generating resistor, wherein the first and second meltable conductors are melted by the heat from the first and second heat-generating resistors and gather on the first and second electrodes to short-circuit the first and second electrodes. 2. The short-circuit element according to claim 1 , wherein the second meltable conductor is blown prior to the first meltable conductor. 3. The short-circuit element according to claim 2 further comprising an insulating layer laminated on the insulating substrate, wherein the first to fifth electrodes are arranged on the insulating layer; and wherein the first and second heat-generating resistors are disposed within the insulating layer or between the insulating layer and the insulating substrate. 4. The short-circuit element according to claim 2 , wherein the first and second heat-generating resistors are disposed within the insulating substrate. 5. The short-circuit element according to claim 2 , wherein the first and second heat-generating resistors are disposed on a surface of the insulating substrate opposite to an electrode-forming surface. 6. The short-circuit element according to claim 2 , wherein the first and second heat-generating resistors are disposed on an electrode-forming surface of the insulating substrate. 7. The short-circuit element according to claim 2 , wherein surfaces of the first electrode and the second electrode are coated with one of Ni/Au plating, Ni/Pd plating and Ni/Pd/Au plating. 8. The short-circuit element according to claim 2 , wherein the first electrode has an area wider than that of the third electrode, and the second electrode has an area wider than those of the fourth and fifth electrodes. 9. The short-circuit element according to claim 2 further comprising: a covering member arranged on the insulating substrate for internal protection; and a covering member electrode arranged on an inner surface of the covering member, wherein the covering member electrode is arranged at a position which overlaps the first electrode and the second electrode. 10. The short-circuit element according to claim 2 further comprising a protective resistor arranged on the insulating substrate and connected to one of the first electrode and the second electrode. 11. The short-circuit element according to claim 2 , wherein at least one of the first and second meltable conductors are a Pb free solder consisting essentially of Sn. 12. The short-circuit element according to claim 2 , wherein at least one of the first and second meltable conductors contains a low melting point metal and a high melting point metal, and wherein the low melting point metal is melted by a heat generated by the heat-generating resistor and erodes the high melting point metal. 13. The short-circuit element according to claim 2 , wherein a first external connecting electrode continuous with the first electrode on the same surface as the meltable conductor, one or more first external connecting terminals provided on the first external connecting electrode, a second external connecting electrode continuous with the second electrode, and one or more second external connecting terminals provided on the second external connecting electrode are formed on the insulating substrate, and wherein a combined resistance of the first external connecting terminal and the second external connecting terminal is lower than a conduction resistance between the first and second external connecting electrodes when the first electrode and the second electrode are short-circuited. 14. The short-circuit element according to claim 13 , wherein the external connecting terminal is one of a metal bump and a metal post. 15. The short-circuit element according to claim 14 , wherein in the metal bump or metal post, a low melting point metal layer is formed on a high melting point metal surface. 16. The short-circuit element according to claim 15 , wherein the high melting point metal consists essentially of copper or silver, and the low melting point metal is a lead-free solder consisting essentially of tin. 17. The short-circuit element according to claim 13 , wherein the external connecting terminal is a metal bump made of a lead-free solder consisting essentially of tin. 18. The short-circuit element according to claim 2 , wherein the second meltable conductor is narrower than the first meltable conductor. 19. The short-circuit element according to claim 18 further comprising an insulating layer laminated on the insulating substrate, wherein the first to fifth electrodes are arranged on the insulating layer; and wherein the first and second heat-generating resistors are disposed within the insulating layer or between the insulating layer and the insulating substrate. 20. The short-circuit element according to claim 18 , wherein the first and second heat-generating resistors are disposed within the insulating substrate. 21. The short-circuit element according to claim 18 , wherein the first and second heat-generating resistors are disposed on a surface of the insulating substrate opposite to an electrode-forming surface. 22. The short-circuit element according to claim 18 , wherein the first and second heat-generating resistors are disposed on an electrode-forming surface of the insulating substrate. 23. The short-circuit element according to claim 18 , wherein surfaces of the first electrode and the second electrode are coated with one of Ni/Au plating, Ni/Pd plating and Ni/Pd/Au plating. 24. The short-circuit element according to claim 18 , wherein the first electrode has an area wider than that of the third electrode, and the second electrode has an area wider than those of the fourth and fifth electrodes. 25. The short-circuit element according to claim 18 further comprising: a covering member arranged on the insulating substrate for internal protection; and a covering member electrode arranged on an inner surface of the covering member, wherein the covering member electrode is arranged at a position which overlaps the first electrode and the second electrode. 26. The short-circuit element according to claim 18 further comprising a protective resistor arranged on the insulating substrate and connected to one of the first electrode and the se

Assignees

Inventors

Classifications

  • for several batteries or cells simultaneously or sequentially · CPC title

  • Heat conducting or heat absorbing means associated with the fusible member, e.g. for providing time delay · CPC title

  • Fuse · CPC title

  • H01H85/055Primary

    Fusible members · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9899179B2 cover?
A bypass avoiding only abnormal cells or abnormal electronic components in an electronic appliance having a plurality of battery cells or electronic components is formed to decrease resistance while keeping functionality.
Who is the assignee on this patent?
Dexerials Corp
What technology area does this patent fall under?
Primary CPC classification H01H85/055. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).