Trap assembly in film forming apparatus

Patent metadata

Field	Value
Publication number	US-9896761-B2
Application number	US-201414491940-A
Country	US
Kind code	B2
Filing date	Sep 19, 2014
Priority date	Mar 19, 2012
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

A trap mechanism for trapping exhaust gas from a process chamber. The trap assembly includes a housing containing a plurality of trap units. The plurality of trap units are arranged successively along a flow direction of said exhaust gas. Each trap unit includes a set of trap panels parallel to each other and spaced apart from each other. The two opposite surfaces with a larger area of each trap panel are oriented substantially parallel to a flow direction of the exhaust gas flow. The two opposite surfaces with a smaller area of each trap panels are oriented orthogonal to the exhaust gas flow.

First claim

What is claimed is:

1. A trap assembly comprising:
a housing configured to form a gas exhaust conduit for an exhaust gas flow discharged from a processing chamber, wherein the housing has an end plate serving as a detachable lid;
a plurality of trap units disposed inside the housing, wherein the plurality of trap units are arranged successively along a flow direction of the exhaust gas flow, wherein each trap unit comprises a set of trap panels parallel to each other and spaced apart from each other, wherein each trap panel comprises a first surface and a second surface that has a smaller surface area than the first surface, wherein respective first surfaces of the set of trap panels are oriented substantially parallel to the flow direction, and wherein respective second surfaces of the set of trap panels are oriented orthogonal to the flow direction;
a supporting rod, wherein the plurality of trap units are coupled to the supporting rod, and wherein the supporting rod is coupled to the endplate; and
a cooling jacket provided to the end plate of the housing to cool trap panels of the plurality of trap units, wherein the cooling jacket is disposed on a downstream side of the exhaust gas flow, wherein the cooling jacket, the supporting rod and the plurality of trap units are configured to cause a temperature gradient in the plurality of trap units along the flow direction, and wherein, with the temperature gradient, a trap unit on an upstream side of the exhaust gas flow has a greater temperature than a trap unit on the downstream side of the exhaust gas flow.

2. The trap assembly of claim 1 , wherein the plurality of trap units comprise a first trap unit and a second trap unit disposed adjacent to the first trap unit, wherein trap panels of the first trap unit are shifted relative to trap panels of the second trap unit in a direction orthogonal to the exhaust gas flow.

3. The trap assembly of claim 2 ,
wherein the set of trap panels comprise a same thickness,
wherein the plurality of trap units comprise a first group of trap units, and
wherein an area sum of projection planes of trap panels of the first group of trap units covers at least 95% of a cross section area of the housing, wherein the projection planes are orthogonal to the flow direction.

4. The trap assembly of claim 1 , wherein the set of trap panels of each trap unit is supported as an integrated unit by a supporting ring.

5. The trap assembly of claim 4 , wherein a coolant path is provided to the supporting ring and the supporting rod.

6. The trap assembly of claim 1 , wherein the plurality of trap units, the supporting rod and the endplate are removable from the housing as an integrated unit.

7. The trap assembly of claim 1 , wherein a gap between adjacent trap panels in a trap unit of a downstream side of the exhaust gas flow is smaller than a gap between adjacent trap panels in a trap unit of an upstream side of the exhaust gas flow.

8. The trap assembly of claim 1 , wherein the set of trap panels comprise coarse surface irregularities.

9. The trap assembly of claim 1 , wherein each trap panel of the plurality of trap units has a manufactured coating layer comprised of a material to be trapped by the trap assembly.

10. A film forming apparatus for forming a thin film on a substrate by using a source gas, the film forming apparatus comprising:
a processing chamber;
a mounting table configured to support the substrate;
a gas introduction unit configured to introduce a gas into the processing chamber;
a gas supply system having a source gas supply system coupled to the gas introduction unit to supply the source gas; and
a gas exhaust system coupled to the processing chamber and configured to receive an exhaust gas flow discharged from the processing chamber,
wherein the gas exhaust system comprises a trap assembly comprising:
a housing configured to form a gas exhaust conduit for the exhaust gas flow, wherein the housing has an end plate serving as a detachable lid;
a plurality of trap units disposed inside the housing, wherein the plurality of trap units are arranged successively along a flow direction of the exhaust gas flow, wherein each trap unit comprises a set of trap panels parallel to each other and spaced apart from each other, wherein each trap panel comprises a first surface and a second surface that has a smaller surface area than the first surface, wherein first surfaces of the set of trap panels are oriented substantially parallel to the flow direction, and wherein second surfaces of the set of trap panels are oriented orthogonal to the flow direction;
a supporting rod, wherein the plurality of trap units are coupled to the supporting rod, and wherein the supporting rod is coupled to the endplate; and
a cooling jacket provided to the end plate of the housing to cool trap panels of the plurality of trap units, wherein the cooling jacket is disposed on a downstream side of the exhaust gas flow, wherein the cooling jacket, the supporting rod and the plurality of trap units are configured to cause a temperature gradient in the plurality of trap units along the flow direction, and wherein, with the temperature gradient, a trap unit on an upstream side of the exhaust gas flow has a greater temperature than a trap unit on the downstream side of the exhaust gas flow.

11. The film forming apparatus of claim 10 , wherein the plurality of trap units comprise a first trap unit and a second trap unit disposed adjacent to the first trap unit, wherein trap panels of the first trap unit are shifted relative to trap panels of the second trap unit in a direction orthogonal to the exhaust gas flow.

12. The film forming apparatus of claim 11 ,
wherein the set of trap panels comprise a same thickness,
wherein the plurality of trap units comprise a first group of trap units, and
wherein an area sum of projection planes of trap panels of the first group of trap units covers at least 95% of a cross section of the housing, wherein the projection planes are orthogonal to the flow direction.

13. The film forming apparatus of claim 10 , wherein the set of trap panels of each trap unit is supported as an integrated unit by a supporting ring.

14. The film forming apparatus of claim 13 , wherein coolant path is provided to the supporting ring and the supporting rod.

15. The film forming apparatus of claim 10 , wherein the plurality of trap units, the supporting rod and the endplate are removable from the housing as an integrated unit.

16. The film forming apparatus of claim 10 , wherein a gap between adjacent trap panels in a trap unit of a downstream side of the exhaust gas flow is smaller than a gap between adjacent trap panels in a trap unit of an upstream side of the exhaust gas flow.

17. The film forming apparatus of claim 10 , wherein the set of trap panels comprise coarse surface irregularities.

18. The film forming apparatus of claim 10 , wherein each trap panel of the plurality of trap units has a manufactured coating layer composed of a material to be trapped by the trap assembly.

Assignees

• Tokyo Electron Ltd

Inventors

• Hara Masamichi
• Yamamoto Kaoru
• Mizusawa Yasushi

Classifications

• C23C16/463

  Cooling of the substrate · CPC title

• C23C16/46

  characterised by the method used for heating the substrate (C23C16/48, C23C16/50 take precedence) · CPC title

• B01D2258/0216

  from CVD treatment or semi-conductor manufacturing · CPC title

• H01J37/32834

  Exhausting · CPC title

• H01J37/32844

  Treating effluent gases · CPC title