De-bonding and cleaning process and system

Patent metadata

Field	Value
Publication number	US-9895871-B2
Application number	US-201715608709-A
Country	US
Kind code	B2
Filing date	May 30, 2017
Priority date	Oct 9, 2014
Publication date	Feb 20, 2018
Grant date	Feb 20, 2018

Abstract

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

First claim

What is claimed is:

1. A method comprising:
de-bonding a surface of a first substrate from a second substrate, the first substrate being attached to a tape; and
after de-bonding, cleaning the surface of the first substrate in a cleaning module comprising a frame and a cover ring attached to the frame;
wherein the cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate, and
wherein during the cleaning the surface, the tape is attached to the frame, the cover ring being over a portion of the tape and over an upper surface of the frame, the cover ring encircling the first substrate.

2. The method of claim 1 , wherein the frame is on a same side of the tape as the first substrate.

3. The method of claim 1 , wherein the cleaning mechanism comprises a sponge.

4. The method of claim 1 , wherein the cleaning mechanism comprises a brush.

5. The method of claim 1 , wherein the cleaning the surface of the first substrate comprises supplying a fluid to the surface of the first substrate.

6. The method of claim 1 , wherein the de-bonding and the cleaning are performed in a same process tool.

7. The method of claim 1 , wherein the first substrate comprises a plurality of singulated dies.

8. The method of claim 7 , wherein the singulated dies are encapsulated in a molding compound.

9. A method comprising:
providing a package substrate bonded to a carrier substrate by a release coating, the release coating being on a surface of the package substrate;
placing the package substrate on a tape, the package substrate being interposed between the carrier substrate and the tape;
separating the carrier substrate from the package substrate; and
after separating the carrier substrate from the package substrate, cleaning the surface of the package substrate in a cleaning module, the tape being held by a frame and a cover ring, the cover ring being over a portion of the tape adjacent the package substrate, and the cover ring extending over at least a portion of an upper surface of the frame;
wherein the cleaning includes supplying a fluid to the surface of the package substrate and contacting the surface of the package substrate with a cleaning mechanism to remove residue from the surface of the package substrate.

10. The method of claim 9 , wherein the surface of the package substrate comprises molding compound.

11. The method of claim 9 , wherein the package substrate comprises a plurality of dies.

12. The method of claim 9 , wherein the release coating comprises a radiation sensitive coating, and wherein separating comprises exposing the release coating to radiation.

13. The method of claim 9 , further comprising, after separating the carrier substrate from the package substrate, placing the carrier substrate in a carrier recycle module.

14. A semiconductor processing tool comprising:
a cleaning module comprising:
a first chuck,
a frame attached to the first chuck, and
a cover ring attached to the frame, the cover ring being configured to encircle a substrate on the first chuck and to cover at least a portion of the first chuck and to cover an upper surface of the frame; and

a carrier recycle module.

15. The semiconductor processing tool of claim 14 , further comprising:
a pre-aligned module configured to align a module to a pre-determined orientation.

16. The semiconductor processing tool of claim 15 , further comprising:
a transfer tool configured to transfer the substrate from the pre-aligned module to the cleaning module.

17. The semiconductor processing tool of claim 14 , wherein the cleaning module further comprises:
a first robot arm having a vacuum, the first robot arm being configured to lift a carrier substrate and place the carrier substrate in the carrier recycle module.

18. The semiconductor processing tool of claim 17 , wherein the cleaning module further comprises:
a second robot arm having a cleaning mechanism attached thereto, the second robot arm being configured to move the cleaning mechanism over a surface of the substrate.

19. The semiconductor processing tool of claim 18 , wherein the second robot arm has a spray nozzle attached thereto, the spray nozzle configured to dispense a fluid onto the substrate.

20. The semiconductor processing tool of claim 14 , wherein the cover ring comprises multiple sections, each section being configured to be rotated onto the upper surface of the frame.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Shih Ying Ching
• Lin Jing Cheng
• Lu Szu Wei

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P70/70

  Cleaning only by lasers processes, e.g. laser ablation · CPC title

• H10P70/40

  Cleaning for reclaiming · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title