Conformal 3D non-planar multi-layer circuitry

Patent metadata

Field	Value
Publication number	US-9894760-B2
Application number	US-201614993197-A
Country	US
Kind code	B2
Filing date	Jan 12, 2016
Priority date	Aug 9, 2012
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.

First claim

What is claimed is:

1. A conformal non-planar multi-layer circuit comprising:
a substrate having a first non-planar surface;
a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the first non-planar surface of the substrate and the first conformal dielectric layer having a second non-planar surface;
a first conformal circuitry layer applied on the first conformal dielectric layer, the first conformal circuitry layer conforming to the second non-planar surface of the first conformal dielectric layer, the first conformal circuitry layer having a third non-planar surface, and the first conformal circuitry layer including a first copper conductive layer;
a second conformal dielectric layer deposited on the first conformal circuitry layer, the second conformal dielectric layer conforming to the third non-planar surface of the first conformal circuitry layer and the second conformal dielectric layer having a fourth non-planar surface; and
a second conformal circuitry layer applied on the second conformal dielectric layer, the second conformal circuitry layer conforming to the fourth non-planar surface of the second conformal dielectric, and the second conformal circuitry layer having a fifth non-planar surface, and the second conformal circuitry layer including a second copper conductive layer.

2. The conformal non-planar multi-layer circuit of claim 1 , wherein the first conformal circuitry layer includes a seed layer.

3. The conformal non-planar multi-layer circuit of claim 1 , wherein the second conformal circuitry layer includes a seed layer.

4. The conformal non-planar multi-layer circuit of claim 1 , wherein the second conformal dielectric layer includes vias.

Assignees

• Lockheed Corp

Inventors

• Gonya Stephen
• Twigg Kenn
• Patterson Jim

Classifications

• H05K3/4644 Primary

  by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602) · CPC title

• H05K2203/0315

  Oxidising metal · CPC title

• H05K2201/09018

  Rigid curved substrate · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title

• H05K1/0298 Primary

  Multilayer circuits · CPC title