Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board

Patent metadata

Field	Value
Publication number	US-9890237-B2
Application number	US-201414900309-A
Country	US
Kind code	B2
Filing date	Feb 27, 2014
Priority date	Jun 26, 2013
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

There is provided an epoxy compound exhibiting excellent heat resistance and flame retardance of a cured product thereof; an epoxy resin containing the epoxy compound; a curable composition and a cured product thereof; and a semiconductor sealing material. The epoxy compound has a diarylene[b,d]furan structure, in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.

First claim

The invention claimed is:

1. An epoxy compound which has a diarylene[b,d]furan structure and in which at least one of two arylene groups has a naphthylene skeleton and two arylene groups each include a glycidyloxy group on an aromatic nucleus thereof.

2. The epoxy compound according to claim 1 , wherein at least one of two arylene groups includes a glycidyloxy group at a para position with respect to a carbon atom to which an oxygen atom, forming a furan ring, is bonded.

3. The epoxy compound according to claim 2 , which has a molecular structure represented by the following Structural Formula (I):

wherein G represents a glycidyl group, Ar represents a structural site represented by the following Structural Formula (i) or (ii);
when Ar represents a structural site represented by Structural Formula (i), R 1 and R 2 each independently represent any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group, or R 1 and R 2 represent a structural site in which an aromatic ring is formed by R 1 and R 2 ;
when Ar represents a structural site represented by Structural Formula (ii), R 1 and R 2 represent a structural site in which an aromatic ring is formed by R 1 and R 2 ; and R 3 represents any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group;

wherein, in Formulae (i) and (ii), G represents a glycidyl group, R 4 and R 5 each independently represent any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group, m represents an integer of 0 to 4, n represents an integer of 0 to 3, when m or n represents 2 or greater, a plurality of R 4 's or R 5 's may be the same as or different from each other, and x and y in Formula (i) each represent a binding point on a naphthalene ring and are bonded to carbons adjacent to each other so as to form a furan ring.

4. The epoxy compound according to claim 3 which has a molecular structure represented by any one of the following Structural Formulae (1) to (4):

wherein, in Formulae (1) to (4), G represents a glycidyl group, R 4 and R 5 each independently represent any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group and an aralkyl group, m represents an integer of 0 to 4, n represents an integer of 0 to 3, when m or n represents 2 or greater, a plurality of R 4 's or R 5 's may be the same as or different from each other, and x and y in Formulae (1) to (3) each represent a binding point on a naphthalene ring and are bonded to carbons adjacent to each other so as to form a furan ring.

5. A curable composition comprising, as essential components: the epoxy compound according to claim 1 ; and a curing agent.

6. A cured product which is obtained by a curing reaction of the curable composition according to claim 5 .

7. A semiconductor sealing material comprising: the curable composition according to claim 5 ; and an inorganic filler.

8. A printed circuit board which is obtained by impregnating a reinforcement basic material with a resin composition varnished by blending the curable composition according to claim 5 with an organic solvent, and superposing a copper foil on the resulting material, followed by heat-pressing.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Takahashi Ayumi

Classifications

• H10W74/473

  containing a filler · CPC title

• H05K1/0326

  containing O · CPC title

• H01L23/295

  Electricity · mapped topic

• H05K3/285

  Permanent coating compositions · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title