Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Patent metadata

Field	Value
Publication number	US-2016130243-A1
Application number	US-201414897363-A
Country	US
Kind code	A1
Filing date	Feb 21, 2014
Priority date	Jun 14, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

There is provided an epoxy compound whose melt viscosity is low and which exhibits heat resistance and flame retardancy of a cured product; an epoxy resin which includes the same; curable composition and cured product; and semiconductor sealing material. The epoxy compound has a molecular structure represented by the following Formula (I):

in the formula, G represents a glycidyl group, and X represents a structural site represented by the following Structural Formula (x1) or (x2);

in Formula (x1) or (x2), k represents an integer of 1 to 3, m represents 1 or 2, Ar represents a structural site represented by the following Structural Formula (Ar1) or (Ar2), and when k or m represents 2 or greater, a plurality of Ar's may be the same as or different from each other:

in Formula (3) or (4), G represents a glycidyl group, and p and r each independently represent 1 or 2.

First claim

1 . An epoxy compound which has a molecular structure represented by the following Formula (I):

wherein G represents a glycidyl group, and X represents a structural site represented by the following Structural Formula (x1) or (x2);

wherein, in Formula (x1) or (x2), R 1 and R 2 each independently represent any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, 1 represents an integer of 0 to 3, n represents an integer of 0 to 4, when 1 or n represents 2 or greater, a plurality of R 1 's or R 2 's may be the same as or different from each other, k represents an integer of 1 to 3, m represents 1 or 2, Ar represents a structural site represented by the following Structural Formula (Ar1) or (Ar2), and when k or m represents 2 or greater, a plurality of Ar's may be the same as or different from each other;

wherein, in Formula (Ar1) or (Ar2), G represents a glycidyl group, p and r each independently represent 1 or 2, R 3 and R 4 each independently represent any of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, or an aralkyl group, R 4 in Formula (Ar2) may be bonded to any one of two aromatic nuclei, q represents an integer of 0 to 4, s represents an integer of 0 to 6, and when q or s represents 2 or greater, a plurality of R 3 's or R 4 's may be the same as or different from each other.

2 . An epoxy resin comprising the epoxy compound according to claim 1 .

3 - 6 . (canceled)

7 . A curable composition comprising, as essential components:
the epoxy compound according to claim 1 ; and a curing agent.

8 . A cured product which is obtained by a curing reaction of the curable composition according to claim 7 .

9 . A semiconductor sealing material comprising:
the curable composition according to claim 7 ; and an inorganic filler.

10 . A printed circuit board which is obtained by impregnating a reinforcement basic material with a resin composition varnished by blending the curable composition according to claim 7 with an organic solvent, and superposing a copper foil on the resulting material, followed by heat-pressing.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Takahashi Ayumi

Classifications

• H10W74/473

  containing a filler · CPC title

• C08G59/3218

  Carbocyclic compounds · CPC title

• H05K1/0373

  containing additives, e.g. fillers (H05K1/036 takes precedence) · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title