Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board

Patent metadata

Field	Value
Publication number	US-9765173-B2
Application number	US-201414900296-A
Country	US
Kind code	B2
Filing date	Feb 27, 2014
Priority date	Jun 26, 2013
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

First claim

The invention claimed is:

1. A curable composition, comprising as essential components: a compound containing a phenolic hydroxyl group, which has a dinaphthofuran skeleton, wherein each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof, and a curing agent.

2. A cured product obtained by a curing reaction of the curable composition according to claim 1 .

3. A semiconductor sealing material, comprising: the curable composition according to claim 1 ; and an inorganic filler.

4. A printed circuit board obtained by impregnating a reinforcement basic material with a resin composition varnished by blending the curable composition according to claim 1 with an organic solvent, and superposing a copper foil on the resulting material, followed by heat-pressing.

5. A curable composition according to claim 1 , wherein at least one of the two naphthylene skeletons has a hydroxyl group at the para position with respect to a carbon atom to which an oxygen atom, forming a furan ring, is bonded.

6. A curable composition according to claim 1 , wherein the compound has a molecular structure represented by the following Structural Formula (I):

wherein each of R 1 and R 2 is independently any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, and an aralkyl group, and each of m and n is independently an integer of 0 to 4, in a case where m or n is 2 or greater, a plurality of R 1 's or R 2 's may be the same as or different from each other, and x and y each represent a bonding point on the naphthalene ring and are bonded to the carbons adjacent to each other so as to form a furan ring.

7. A compound containing a phenolic hydroxyl group, which has a dinaphthofuran skeleton, wherein each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof, wherein at least one of the two naphthylene skeletons has a hydroxyl group at the para position with respect to a carbon atom to which an oxygen atom, forming a furan ring, is bonded, and at least one of the naphthylene skeleton is selected from a group consisting of 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, and mixtures thereof; wherein each of two naphthylene skeletons further contains 0 to 4 of R 1 or R 2 substituents, and R 1 and R 2 is independently any one of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an aryl group, and an aralkyl group, in a case where the substituents on one naphthylene skeleton is 2 or greater, a plurality of R 1 's or R 2 's may be the same as or different from each other.

8. The compound containing a phenolic hydroxyl group according to claim 7 , which is selected from the following compounds and mixtures thereof:

Assignees

• Dainippon Ink & Chemicals

Inventors

• Satou Yutaka
• Takahashi Ayumi

Classifications

• H10W74/473

  containing a filler · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H05K1/0326

  containing O · CPC title

• C08L61/04

  Condensation polymers of aldehydes or ketones with phenols only · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title