Method and apparatus for enhanced cleaning and inspection

Patent metadata

Field	Value
Publication number	US-9889477-B2
Application number	US-201514857650-A
Country	US
Kind code	B2
Filing date	Sep 17, 2015
Priority date	Jul 5, 2012
Publication date	Feb 13, 2018
Grant date	Feb 13, 2018

Abstract

A cleaning and inspection system includes a cleaning chamber and retaining structure disposed within the cleaning chamber and configured to secure an article to be cleaned within the cleaning chamber. The cleaning and inspection system also includes a gas distributor disposed within the cleaning chamber and configured to distribute a turbulent flow of gas into the cleaning chamber that facilitates removal of foreign particles from a surface of the article. Further, the system includes a particle collection surface positioned to collect foreign particles removed from the surface of the article.

First claim

What is claimed is:

1. A method of cleaning and inspecting an article, comprising:
securing the article within a cleaning chamber using a retaining structure;
distributing a turbulent flow of gas into the cleaning chamber to facilitate removal of any foreign particles attached to a surface of the article;
collecting any foreign particles removed from the surface of the article on a particle collection surface, the particle collection surface being a surface of a semiconductor substrate; and
inspecting the particle collection surface to determine a presence of any foreign particles removed from the surface of the article.

2. The method of claim 1 , wherein the collecting includes directing any foreign particles removed from the surface of the article toward the particle collection surface.

3. The method of claim 1 , further including inspecting, prior to the collecting, the particle collection surface to determine a presence of any pre-existing particles.

4. The method of claim 1 ,
wherein the particle collection surface is a surface of a silicon wafer; and
wherein the inspecting includes inspecting the surface of the silicon wafer with a semiconductor wafer inspection tool.

5. The method of claim 1 , wherein the distributing includes distributing a gas into the cleaning chamber through a plurality of differently-sized distribution apertures, the plurality of differently-sized distribution apertures creating the turbulent flow of gas.

6. The method of claim 1 , wherein the distributing includes distributing charged gas molecules into the cleaning chamber to electrically neutralize any charged foreign particles attached to the surface of the article.

7. The method of claim 1 , further including imparting physical movement in the article with a vibration generator disposed in the cleaning chamber to facilitate the removal of any foreign particles attached to the surface of the article.

8. A method of cleaning and inspecting an article, comprising:
securing the article within a cleaning chamber using a retaining structure, wherein the article is an apparatus configured to transport or store one or more photomasks;
distributing a turbulent flow of electrically charged gas into the cleaning chamber to facilitate removal of any foreign particles attached to a surface of the article, the turbulent flow of electrically charged gas neutralizing any electrically charged foreign particles attached to a surface of the article;
directing the turbulent flow of electrically charged gas into a particle collection chamber with a pass-through chamber interposed between the cleaning chamber and the particle collection chamber;
collecting any foreign particles removed from the surface of the article on a particle collection surface in the particle collection chamber, the particle collection surface having width at least as great as a width of the pass-through chamber; and
inspecting the particle collection surface to determine a presence of any foreign particles removed from the surface of the article.

9. The method of claim 8 ,
wherein the particle collection surface is a silicon wafer; and
wherein the inspecting includes inspecting the silicon wafer with a semiconductor wafer inspection tool.

10. The method of claim 8 , wherein the distributing includes distributing a gas into the cleaning chamber through a plurality of differently-sized distribution apertures, the plurality of differently-sized distribution apertures creating the turbulent flow of gas.

11. The method of claim 8 , further including imparting physical movement in the article with a vibration generator disposed in the cleaning chamber to facilitate the removal of any foreign particles attached to the surface of the article.

12. The method of claim 11 , wherein the imparting physical movement in the article includes directing ultrasonic waves at the article to impart vibrations in the article.

13. The method of claim 11 , wherein the imparting physical movement in the article includes directing pulsed laser energy at the article to impart shock waves in the article.

14. The method of claim 8 , wherein the distributing the turbulent flow of electrically charged gas includes distributing the turbulent flow of electrically charged gas with a plurality of gas distributors disposed in the cleaning chamber.

15. The method of claim 8 , further including converting oxygen in the cleaning chamber into ozone gas to facilitate decomposition of organic particles attached to the surface of the article.

16. A method of cleaning and inspecting an article, comprising:
securing the article within a cleaning chamber using a retaining structure, wherein the retaining structure is rotatable about its longitudinal axis;
distributing a turbulent flow of gas into the cleaning chamber to facilitate removal of any foreign particles attached to a surface of the article;
imparting physical movement in the article with a vibration generator disposed in the cleaning chamber to facilitate the removal of any foreign particles attached to the surface of the article;
directing the turbulent flow of gas into a particle collection chamber by creating a pressure differential between the cleaning chamber and the particle collection chamber;
concurrently rotating the article by rotating the retaining structure about its longitudinal axis during cleaning;
collecting any foreign particles removed from the article on a particle collection surface; and
inspecting the particle collection surface to determine a presence of any foreign particles removed from the article.

17. The method of claim 16 , wherein the collecting includes securing the foreign particles to the particle collection surface with a coating on the particle collection surface.

18. The method of claim 16 , wherein the distributing includes distributing a gas into the cleaning chamber through a plurality of differently-sized distribution apertures, the plurality of differently-sized distribution apertures creating the turbulent flow of gas.

19. The method of claim 16 , wherein the distributing the turbulent flow of gas includes distributing the turbulent flow of gas with a plurality of gas distributors disposed in the cleaning chamber.

20. The method of claim 16 , further including converting oxygen in the cleaning chamber into ozone gas to facilitate decomposition of organic particles attached to the surface of the article.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Lu Chi Lun
• Chin Sheng Chi

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/1906

  specially adapted for containing masks, reticles or pellicles · CPC title

• H10P72/0406

  for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

• H10P70/23

  during, before or after processing of insulating materials · CPC title

• B05C13/02

  for particular articles · CPC title