Substrate treating method and treatment liquid
US-2024339317-A1 · Oct 10, 2024 · US
US9209010B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9209010-B2 |
| Application number | US-201113579772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 3, 2011 |
| Priority date | Feb 19, 2010 |
| Publication date | Dec 8, 2015 |
| Grant date | Dec 8, 2015 |
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A substrate cleaning method includes removing a foreign material attached to a substrate while preventing deterioration of the substrate and any film formed on or above the substrate. A cleaning gas at a pressure between 0.3 MPa and 2.0 MPa is sprayed towards a wafer W with attached foreign material 22 placed in a near-vacuum, producing clusters 21 made up of a multitude of gas molecules 20 , and the clusters 21 collide with the wafer W without undergoing ionization.
Opening claim text (preview).
What is claimed is: 1. A substrate cleaning method comprising: forming a cluster including gas molecules by spraying, toward a substrate to which a foreign material is attached and which is disposed in a low pressure atmosphere, a high pressure gas having a pressure higher than that of the low pressure atmosphere by using a gas spraying unit which includes a base portion and a cooling unit which extends from an end portion of the base portion; allowing the cluster to collide wi…
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