Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

Patent metadata

Field	Value
Publication number	US-9309446-B2
Application number	US-201213410702-A
Country	US
Kind code	B2
Filing date	Mar 2, 2012
Priority date	Oct 30, 2009
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

First claim

What is claimed is:

1. A photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein
the composition comprises an (A) alkali-soluble polyimide resin obtained by reacting a tetracarboxylic acid dianhydride with a diamine containing 10 mol % to 80 mol % of a phenolic hydroxyl group-containing diamine represented by formula (A-1) based on the diamines in total and an aliphatic ether diamine represented by formula (8):

wherein R 1 , R 2 and R 3 are independently alkylene groups having 1 to 10 carbons atoms,
wherein in the above formulae b is an integer between 2 and 80, and

a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.

2. The photosensitive adhesive composition according to claim 1 , wherein a Tg after exposure and further heat curing is not less than 80° C.

3. The photosensitive adhesive composition according to claim 1 , wherein a lowest melt viscosity at 20° C. to 200° C. after exposure is not more than 30000 Pa·s.

4. The photosensitive adhesive composition according to claim 1 , comprising a (B) radiation polymerizable compound, and a (C) photoinitiator.

5. The photosensitive adhesive composition according to claim 1 , wherein a Tg of the (A) alkali-soluble resin is 40° C. to 150° C.

6. The photosensitive adhesive composition according to claim 4 , wherein the (A) alkali-soluble resin is a polyimide resin having a carboxyl group and/or a hydroxyl group.

7. The photosensitive adhesive composition according to claim 1 , wherein the (B) radiation polymerizable compound contains at least one (meth)acrylate having a functionality of 3or more.

8. The photosensitive adhesive composition according to claim 4 , further comprising a (D) epoxy resin.

9. The photosensitive adhesive composition according to claim 8 , wherein the (D) epoxy resin contains at least one of a bisphenol F epoxy resin and a bisphenol A epoxy resin.

10. The photosensitive adhesive composition according to claim 4 , further comprising an (E) compound having an ethylenically unsaturated group and an epoxy group.

11. The photosensitive adhesive composition according to claim 4 , further comprising an (F) filler.

12. A film-like adhesive obtained by molding the photosensitive adhesive composition according to claim 1 into a film-like shape.

13. An adhesive sheet comprising a base material, and an adhesive layer formed on the base material and composed of the film-like adhesive according to claim 12 .

14. An adhesive pattern obtained by exposing an adhesive layer laminated on an adherent and composed of the film-like adhesive according to claim 12 , and performing a developing treatment on the adhesive layer after exposure with an alkali developer.

15. A semiconductor wafer with an adhesive layer comprising:
a semiconductor wafer; and
an adhesive layer laminated on the semiconductor wafer and composed of the film-like adhesive according to claim 12 .

16. A transparent substrate with an adhesive layer comprising:
a transparent substrate; and
an adhesive layer laminated on the transparent substrate and composed of the film-like adhesive according to claim 12 .

17. A semiconductor device having a structure in which using the photosensitive adhesive composition according to claim 1 , semiconductor elements are bonded to each other, and/or a structure in which using the photosensitive adhesive composition according to claim 1 , a semiconductor element and a semiconductor element-mounting support member are bonded to each other.

18. The semiconductor device according to claim 17 , wherein the semiconductor element-mounting support member is a transparent substrate.

19. The photosensitive adhesive composition according to claim 1 , wherein a Tg of the (A) alkali-soluble resin is at least 60° C.

20. The photosensitive adhesive composition according to claim 1 , further comprising a (B) radiation polymerizable compound containing at least one (meth)acrylate having a functionality of at least 2.

21. The photosensitive adhesive composition according to claim 1 , further comprising:
a (B) radiation polymerizable compound;
a (C) photoinitiator;
an (D) epoxy resin;
a curing agent; and
a (F) filler.

22. The photosensitive adhesive composition according to claim 1 , wherein the content of the diamine represented by formula (A-1) is 30 mol % to 70 mol % in total.

23. The photosensitive adhesive composition according to claim 1 , wherein the photosensitive adhesive composition has a property of airtight sealing.

24. The photosensitive adhesive composition according to claim 1 , wherein the photosensitive adhesive composition is configured to form an adhesive pattern on a transparent substrate of a solid-state imaging element.

Assignees

• Mitsukura Kazuyuki
• Kawamori Takashi
• Masuko Takashi
• Katogi Shigeki
• Hitachi Chemical Co Ltd

Inventors

• Mitsukura Kazuyuki
• Kawamori Takashi
• Masuko Takashi
• Katogi Shigeki

Classifications

• H10P72/7404

  the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W90/28

  the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape · CPC title

• H10W72/075

  of bond wires · CPC title

• H10W72/073

  of die-attach connectors · CPC title