Sensor

Patent metadata

Field	Value
Publication number	US-9863829-B2
Application number	US-201515500542-A
Country	US
Kind code	B2
Filing date	Jul 23, 2015
Priority date	Aug 1, 2014
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A sensor has an electronic chip and a sensor chip which are arranged within a functional volume which is at the most 4-5 mm long, a maximum 2-3 mm wide, and the maximum height is 0.5-0.8 mm, thereby potentially providing a compact sensor.

First claim

The invention claimed is:

1. A sensor, comprising:
an electronic chip;
a sensor chip; and
a printed circuit board,
wherein the electronic chip and the sensor chip are arranged within a functional volume which has a length in a range of from 4 to 5 mm, a width in a range of from 2 to 3 mm, and a height in a range of from 0.5 to 0.8 mm, and
wherein the electronic chip and the sensor chip are each directly mounted on the printed circuit board and arranged so as to be next to one another on the printed circuit board.

2. The sensor of claim 1 , comprising:
a plurality of the electronic chip and/or a plurality of the sensor chip, arranged within the functional volume.

3. The sensor of claim 1 , wherein the electronic chip includes a plurality of analog and/or digital interfaces configured to analyze various sensor chips.

4. The sensor of claim 1 , configured to cordlessly transmit power and/or data using the electronic chip and/or the sensor chip via a radio interface or via a non-pluggable connection of contacts.

5. The sensor of claim 1 , wherein the sensor chip includes a converter element and/or a converter element and a sensor front end.

6. The sensor of claim 5 , wherein the converter element is configured as a transistor or resistor on a silicon diaphragm.

7. The sensor of claim 1 , configured such that a pressure differential in a range of 10-500 Pa can be measured using the sensor chip.

8. The sensor of claim 7 , wherein the sensor chip has a resolution of 5 Pa.

9. The sensor of claim 7 , wherein the sensor chip has a resolution in a range of from 1 Pa to less than 5 Pa.

10. The sensor of claim 7 , wherein the sensor chip has a resolution in a range of from greater than 5 Pa to 10 Pa.

11. The sensor of claim 1 , wherein the electronic chip and the sensor chip are interconnected in an electrically conductive manner by bonding wires.

12. The sensor of claim 1 , wherein the electronic chip and the sensor chip are interconnected in an electrically conductive manner by a flip-chip connection using contacting bumps.

13. The sensor of claim 1 , wherein the sensor chip includes a diaphragm and an electronic device.

14. The sensor of claim 1 , wherein the sensor chip includes a silicon substrate into which a diaphragm that does not have any electronic devices and/or oxide layers except for converter elements is etched.

15. The sensor of claim 1 , wherein a passage is formed in the printed circuit board,
wherein the passage constitutes the only fluid-conductive access to a volume formed by the printed circuit board, the sensor chip, and a sealing collar which surrounds the sensor chip, and
wherein a first diaphragm surface of a diaphragm faces the volume.

Assignees

• Freudenberg Carl Kg
• Edc Electronic Design Chemnitz Gmbh

Inventors

• Caesar Thomas
• Tapper Renate
• Heinz Steffen
• Neubert Marco

Classifications

• H10W90/753

  between laterally-adjacent chips · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/50

  Bond wires · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• B81B7/008

  MEMS characterised by an electronic circuit specially adapted for controlling or driving the same (B81B7/0087 takes precedence; arrangements for starting, regulating, braking, or otherwise controlling an actuator H02N; control arrangements or circuits for visual indicators G09G3/00) · CPC title