Method for electroless metallization

Patent metadata

Field	Value
Publication number	US-9863044-B2
Application number	US-201314042527-A
Country	US
Kind code	B2
Filing date	Sep 30, 2013
Priority date	Sep 30, 2012
Publication date	Jan 9, 2018
Grant date	Jan 9, 2018

Abstract

A method for forming a polymerized film on a surface of a non-conductive material and subsequently forming an electroless metal plating film on the surface is described. The method includes the step of contacting the surface of the material with a solution including (A) an amine compound having at least two functional groups, where at least one of the functional groups is an amino group, and (B) an aromatic compound having at least one hydroxyl group on the aromatic ring.

First claim

What is claimed is:

1. A method for forming a metallic film on a surface of a material comprising:
a) contacting the surface of the material with a solution comprising a free radical initiator;
b) contacting the surface of the material with the free radical initiator with a solution consisting of (A) an amine compound selected from the group consisting of
H 2 N—R 1 —NH 2   (formula 1a)

wherein R 1 is selected from the group consisting of C 1 to C 24 linear or branched alkylene and aromatic alkylene;
H 2 N—R 1 —NH—R 2 —NH 2   (formula 2a )

wherein R 1 and R 2 are selected independently from the group consisting of C 1 to C 24 linear or branched alkylene and aromatic alkylene;

wherein R 1 , R 2 , and R 3 are selected independently from the group consisting of C 1 to C 20 linear or branched alkylene and aromatic alkylene;

wherein R 1 , R 2 , and R 3 are selected independently from the group consisting of C 1 to C 20 linear or branched alkylene and aromatic alkylene;

wherein R 1 , R 2 , R 3 , R 4 , and R 5 are selected independently from the group consisting of C 1 to C 16 linear or branched alkylene and aromatic alkylene; and

wherein R 6 is selected from the group consisting of

and; (B) a compound having a formula:

wherein R 8 is selected from the group consisting of H, CH 3 , phenyl, CN, NO 2 , propanoic acid, ethylamine, formic acid and formaldehyde, R 9 and R 10 are independently selected from the group consisting of H and OH; (C) a medium of the solution is selected from the group consisting of water Reverse Osmosis water and de-ionized water, and (D) a buffer selected from the group consisting of K 2 HPO 4 /citric acid and H 3 BO 3 /KCl/NaOH;

c) polymerizing the (A) compound and the (B) compound by Michael Addition on the surface of the material to form the polymerized film;
d) applying an electroless metal plating bath to the surface of the material comprising the polymerized film; and
e) conducting electroless metal plating on the material comprising the polymerized film.

2. The method according to claim 1 , wherein a mole ratio of the functional groups within (A) to the functional groups within (B) is from 10:1 to 1:10.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Rzeznik Maria Anna
• Knudsen Philip D
• Wang Xuesong
• Bayes Martin W
• Tsai Yuhsin

Classifications

• C23C18/18 Primary

  Pretreatment of the material to be coated · CPC title

• C23C18/1653

  Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title

• C23C18/40

  using reducing agents · CPC title

• C23C18/1651

  Two or more layers only obtained by electroless plating · CPC title