Direct integration of feedthrough to implantable medical device housing with ultrasonic welding

Patent metadata

Field	Value
Publication number	US-9855008-B2
Application number	US-201615363886-A
Country	US
Kind code	B2
Filing date	Nov 29, 2016
Priority date	Dec 12, 2013
Publication date	Jan 2, 2018
Grant date	Jan 2, 2018

Abstract

One aspect is an implantable medical device including a metal housing configured for implantation in a human and including a biocompatible metal and defining an opening. A feedthrough device is configured within the opening of the metal housing and includes an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing. An ultrasonic joint is configured between the feedthrough device and metal housing that hermetically and mechanically bonds the feedthrough device and metal housing. The biocompatible metal of the housing is a microstructure primarily having α-phase grains.

First claim

What is claimed is:

1. An implantable medical device comprising:
a metal housing configured for implantation in a human and comprising a biocompatible metal and defining an opening;
a feedthrough device configured within the opening of the metal housing and comprising an insulating section and a conducting section, the insulating section electrically isolating the conducting section from the metal housing; and
an ultrasonic joint between the feedthrough device and metal housing that hermetically and mechanically bonds the feedthrough device directly to the metal housing without any intervening ferrule;
characterized in that the biocompatible metal of the housing comprises a microstructure primarily having α-phase grains.

2. The implantable medical device of claim 1 , further characterized in that the biocompatible metal of the housing comprises a microstructure having substantially no β-phase grains.

3. The implantable medical device of claim 1 , further comprising a biocompatible bonding material between the feedthrough device and metal housing.

4. The implantable medical device of claim 1 , wherein the biocompatible metal of the housing comprises titanium, niobium or a combination thereof.

5. The implantable medical device of claim 1 , wherein the biocompatible metal of the housing has an average grain size less than 425 μm.

6. The implantable medical device of claim 1 , wherein the biocompatible metal of the housing has an average grain size less than 300 μm.

7. The implantable medical device of claim 1 , wherein the biocompatible metal of the housing has an average grain size less than 100 μm.

8. The implantable medical device of claim 1 , wherein the biocompatible metal of the housing has an average grain size in the range of 10-40 μm.

9. The implantable medical device of claim 1 , wherein an interface between the feedthrough and metal housing is substantially angled relative an exterior surface of the metal housing.

10. The implantable medical device of claim 1 , wherein a width on the opening of the housing is smaller than a width of the feedthrough device at its widest distance between two opposing sides.

11. An implantable medical device comprising:
a housing having an opening with an opening width;
a feedthrough including an insulator having a bottom surface and side surfaces and having an insulator width between opposing side surfaces that is greater than the opening width; and
a ultrasonic joint between at least one of the bottom surface, top surface, and side surfaces of the insulator and the housing which hermetically seals the insulator directly to the housing without any intervening ferrule.

12. The implantable medical device of claim 11 , wherein the insulator width between opposing side surfaces is two times greater than the opening width.

13. The implantable medical device of claim 11 , characterized in that the housing comprises a biocompatible metal comprising a microstructure primarily having α-phase grains.

14. The implantable medical device of claim 13 , characterized in that the biocompatible metal of the housing comprises a microstructure having substantially no β-phase grains.

15. The implantable medical device of claim 11 , wherein the housing comprises a metal having an average grain size less than 300 μm.

16. The implantable medical device of claim 11 , wherein the biocompatible metal of the housing has an average grain size less than 100 μm.

17. The implantable medical device of claim 11 , wherein the biocompatible metal of the housing has an average grain size in the range of 10-40 μm.

Assignees

• Heraeus Deutschland Gmbh & Co Kg
• Heraeus Deutschland Gmbh & Co Lg

Inventors

• Markham Jacob
• Hausch Ulrich

Classifications

• B23K20/16

  with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas · CPC title

• B23K20/10

  making use of vibrations, e.g. ultrasonic welding · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• B23K2101/36

  Electric or electronic devices · CPC title