High speed laser processing of transparent materials

US9850159B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9850159-B2
Application numberUS-201314443751-A
CountryUS
Kind codeB2
Filing dateNov 20, 2013
Priority dateNov 20, 2012
Publication dateDec 26, 2017
Grant dateDec 26, 2017

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  1. Title

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  2. Abstract

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method and system for laser pre-cutting a layered material ( 31 ) with a laser beam ( 14 ) is disclosed. The layered material ( 31 ) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL 1 , CSL 2 ), and at least one interface region (IR 1 , IR 2 ) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL 1 , CSL 2 ) and is transparent to allow propagation of the laser beam ( 14 ) through the layered material ( 31 ). The method may comprise setting an optical beam path ( 8 ) and a laser characteristic of the laser beam ( 14 ) such that an interaction of the laser beam ( 14 ) with the layered material ( 31 ) generates an elongate damage region ( 57 ) in the layered material ( 31 ), and, for each of a series of pre-cut positions (X N−1 , X N , X N+1 ) of the layered material ( 31 ), pre-cutting the layered material ( 31 ) by positioning the layered material ( 31 ) and the laser beam ( 14 ) with respect to each other and irradiating the laser beam ( 14 ) such that the respective elongate damage regions ( 57 ) extend across the at least one interface region (IR 1 , IR 2 ).

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for laser pre-cutting a layered material with a pulsed Bessel-like laser beam or a filament forming Gaussian beam, wherein the layered material comprises at least one tensile stress layer, at least one compression stress layer, and at least one interface region between the at least one tensile stress layer and the at least one compression stress layer and the layered material is transparent to allow propagation of the laser beam through the layered material, the method comprising: setting an optical beam path and a laser characteristic of the laser beam such that an interaction of the laser beam with the layered material generates an elongate single laser pulse damage region in the layered material; and for each of a series of pre-cut positions of the layered material, pre-cutting the layered material by positioning the layered material and the laser beam with respect to each other and irradiating the laser beam such that the respective elongate single laser pulse damage regions extend across the at least one interface region. 2. The method of claim 1 , wherein the optical beam path and the laser characteristic of the laser beam are set such that: the elongate damage region is characterized by an aspect ratio in the range from 10 to 1000; or the distance between neighboring elongate damage regions is in the range from 0.5 μm to 4 μm; or the laser pulse duration is in the range from 1 ps to 100 ps; or the Bessel-like beam has a conical half-angle in the range from 4° to 30°. 3. The method of claim 1 , wherein: the layered material comprises a front face, and the at least one tensile stress layer or the at least one compression stress layer is positioned between the front face and the at least one interface region; and the pre-cutting is performed such that the respective elongate damage region extends from the front face through the at least one tensile stress layer or the at least one compression stress layer and across the at least one interface region into a respective neighboring layer; or the layered material comprises a back face, and the at least one tensile stress layer or the at least one compression stress layer is positioned between the back face and the at least one interface region, and the pre-cutting is performed such that the respective elongate damage regions extend from the back face through the at least one tensile stress layer or the at least one compression stress layer and across the at least one interface region into the respective neighboring layer. 4. The method of claim 1 , wherein the layered material comprises a center tensile stress layer or a center compression stress layer that is centered between a pair of interface regions, and wherein the pre-cutting is performed such that the respective elongate damage regions extend at least through 30% of the center tensile stress layer or the center compression stress layer. 5. The method of claim 1 , wherein the pre-cutting is performed such that the respective elongate damage regions extend at least through 50% of a thickness of the layered material. 6. The method of claim 1 , wherein the pre-cutting is performed for neighboring elongate damage regions such that the neighboring elongate damage regions are displaced with respect to each other by a distance of at least 1 μm. 7. The method of claim 1 , wherein the laser beam is a pulsed Bessel-like laser beam or a filament forming Gaussian beam, and wherein the pre-cutting is performed with a single laser pulse for each pre-cut position such that the elongate damage regions are a single laser pulse damage regions or the layered material is essentially transparent with respect to single photon absorption of the laser beam when propagating through the material. 8. The method of claim 1 , wherein single laser pulse, damage regions of successive laser pulses following immediately one another are displaced with respect to each other at a first level within the material for a first scanning sequence and at a second level within the material for a second scanning sequence. 9. The method of claim 1 , wherein the material has a plate-like shape and the scanning is performed in direction of the extension of the plate such that neighboring elongate single laser pulse damage regions are displaced with respect to each other by a minimum distance of at least 80% of a beam waist at full width half maximum of a core of the pulsed Bessel-like laser beam present within the single laser pulse damage region, or by at least 1 μm, such that the displacement of neighboring elongate single laser pulse damage regions is selected such that a first single laser pulse damage region of a first pulse essentially does not affect the propagation of a second pulse generating a second single laser pulse damage region next to the first single laser pulse damage region. 10. The method of claim 1 , wherein the optical beam path and the laser characteristic are selected such that a multi-photon process in the regime of optical breakdown photoionization is the underlying process of the single laser pulse damage, thereby defining a damage threshold for parameters of the optical beam path and the laser characteristic of the Bessel-like laser beam, and wherein the pulse duration is selected such that the multi-photon process is accompanied by an electron avalanche photoionization. 11. The method of claim 1 , further comprising: receiving information on a thickness of the material; determining a minimum length of the elongate single laser pulse damage region that is required for breaking the material with a preset break quality; for the pre-cutting, determining a pulse energy above a minimum laser pulse energy corresponding to the minimum length; and performing at least one of the following selections: for the minimum laser pulse energy and a set conical half-angle, selecting a pulse duration above a threshold laser pulse duration for single laser pulse damage or selecting a beam diameter of the pulsed Bessel laser beam before a final focusing lens; for at least the minimum laser pulse energy and a set pulse duration, selecting a conical half-angle above a threshold conical half-angle; or selecting the laser pulse energy, the conical half-angle, or the pulse duration; such that the single laser pulse damage regions extend at least over the minimum length or such that a peak fluence of the pulsed Bessel-like laser beam stays above a threshold for optical break down at least for the determined minimum length. 12. The method of claim 1 , further comprising separating a material part from a material comprising at least one tensile stress layer, at least one compression stress layer, and at least one interface region between the at least one tensile stress layer and the at least one compression stress layer, by the steps of: applying a separating force onto the layered material that acts across the series of pre-cut positions, thereby cleaving the layered material along the series of pre-cut positions; or applying a temperature difference across the layered material; wherein the extent of the elongate damage regions is sufficient that after a time interval the internal stress of the stress layers initiates self-separation of the material part. 13. The method of claim 1 , wherein the optical beam path and the laser characteristic of the laser beam are set such that: the laser pulse duration is in the range from 1 ps to 100 ps; and the Bessel-like beam has a conical half-angle in the range from 5° to 30°. 14. The method of claim 1 , wherein the elongate single laser pulse damage region has a cross-section with a

Assignees

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Classifications

  • Scoring using a focussed radiation beam, e.g. laser · CPC title

  • Apparatus for opening score lines in glass sheets · CPC title

  • Operations & Transport · mapped topic

  • taking account of the properties of the material involved · CPC title

  • Operations & Transport · mapped topic

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What does patent US9850159B2 cover?
A method and system for laser pre-cutting a layered material ( 31 ) with a laser beam ( 14 ) is disclosed. The layered material ( 31 ) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL 1 , CSL 2 ), and at least one interface region (IR 1 , IR 2 ) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL 1 ,…
Who is the assignee on this patent?
Uab Altechna R&D, Corning Inc
What technology area does this patent fall under?
Primary CPC classification C03B33/0222. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Dec 26 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).