Magnetic intermetallic compound interconnect
US-8939347-B2 · Jan 27, 2015 · US
Magnetic intermetallic compound interconnect
US9847308B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9847308-B2 |
| Application number | US-201414566185-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 10, 2014 |
| Priority date | Apr 28, 2010 |
| Publication date | Dec 19, 2017 |
| Grant date | Dec 19, 2017 |
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- Title
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- Abstract
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- Assignees and inventors
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Abstract
Official abstract text for this publication.
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.
First claim
Opening claim text (preview).
What is claimed is: 1. A microelectronic interconnection, comprising: a first metallic attachment structure on a substrate; a dielectric layer over the substrate and the first metallic attachment structure, wherein the dielectric layer has an opening therethrough to a portion of the first metallic attachment structure; a magnetic composite material adjacent the first metallic attachment structure, wherein the magnetic composite material resides entirely within the dielectric layer opening; and a solder material adjacent the magnetic composite material, wherein at least a portion of the solder material resides within the dielectric layer opening. 2. The microelectronic interconnection of claim 1 , wherein the magnetic composite material comprises magnetic particles dispersed in a solder paste. 3. The microelectronic interconnection of claim 2 , wherein the magnetic particles comprises iron, cobalt, nickel, or alloys thereof. 4. The microelectronic interconnection of claim 2 , wherein the magnetic particles comprises an iron and cobalt alloy. 5. The microelectronic interconnection of claim 2 , wherein the solder paste comprises a tin and silver solder paste. 6. A microelectronic package, comprising: a first metallic attachment structure on a substrate; a dielectric layer over the substrate and the first metallic attachment structure, wherein the dielectric layer has an opening therethrough to expose a portion of the first metallic attachment structure; a magnetic composite material adjacent the first metallic attachment structure, wherein the magnetic composite material resides entirely within the dielectric layer opening; a solder material adjacent the magnetic composite material, wherein at least a portion of the solder material resides within the dielectric layer opening; and a microelectronic device having at least one attachment projection attached to the solder material. 7. The microelectronic package of claim 6 , wherein the magnetic composite material comprises magnetic particles dispersed in a solder paste. 8. The microelectronic package of claim 7 , wherein the magnetic particles comprise iron, cobalt, nickel, or alloys thereof. 9. The microelectronic package of claim 7 , wherein the magnetic particles comprise an iron and cobalt alloy. 10. The microelectronic package of claim 7 , wherein the solder paste comprises a tin and silver solder paste.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
changes in materials · CPC title
Soldering or alloying · CPC title
Applying EM radiation, e.g. induction heating or using a laser · CPC title
Means for applying energy, e.g. ovens or lasers · CPC title
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Frequently asked questions
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- What does patent US9847308B2 cover?
- The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components compr…
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W90/701. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).