Heat treatment apparatus

Patent metadata

Field	Value
Publication number	US-9845991-B2
Application number	US-201314067318-A
Country	US
Kind code	B2
Filing date	Oct 30, 2013
Priority date	Oct 31, 2012
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

Provided is a heat treatment apparatus, which includes: a cylindrical quartz reaction tube having a furnace opening and a bottom flange at a lower portion thereof; a flange holding part configured to hold the bottom flange of the reaction tube; and a lid including a metal lid and a quartz lid supported by the metal lid, the quartz lid being configured to close the furnace opening of the reaction tube. The quartz lid is fixed onto the metal lid by a support ring. The support ring is brought into contact with a bottom surface of the flange holding part so that a gap is defined between the quartz lid and the bottom flange. A sealing member is arranged outward from the gap in a radial direction.

First claim

What is claimed is:

1. A heat treatment apparatus, comprising:
a cylindrical quartz reaction tube having an opening and a bottom flange at a lower portion thereof;
a flange holding part configured to hold the bottom flange of the reaction tube; and
a lid including a metal lid and a quartz lid supported by the metal lid, the quartz lid being configured to close the opening of the reaction tube,
wherein the quartz lid is fixed onto the metal lid by a support ring and a cover ring is fixed to the support ring,
wherein a circumferential protrusion is formed in an upper surface of the quartz lid such that, when the opening is closed by the lid, an upper surface of the circumferential protrusion faces a lower surface of the bottom flange in a separated and parallel relationship between the upper surface of the circumferential protrusion and the lower surface of the bottom flange,
wherein the support ring is brought into contact with a bottom surface of the flange holding part through the cover ring and a buffering member having a flattened cross-sectional shape, made of polyimide and arranged on top of a screw penetrating the cover ring, the support ring and the metal lid so that there is no contact between the quartz lid and the bottom flange and a gap is defined between the upper surface of the circumferential protrusion and the lower surface of the bottom flange,
wherein a sealing member is arranged between the support ring and the bottom flange, and
wherein, when the opening is closed by the lid, the sealing member makes contact with the support ring, the bottom flange and the circumferential protrusion.

2. The apparatus of claim 1 , wherein the sealing member is of an approximately Q-shape in a cross section and includes a lip portion fixed by a cover ring, the cover ring being arranged on the support ring.

3. The apparatus of claim 1 , wherein the support ring is made of metal and includes a cooling water path formed therein and configured to cool the sealing member.

4. The apparatus of claim 1 , wherein the quartz lid includes a circumferential groove formed in an upper surface of the quartz lid radially inward from the sealing member in the radial direction of the reaction tube, the circumferential groove being configured to block heat which is radiated outward from a central portion of the quartz lid in the radial direction of the quartz lid along the upper surface of the quartz lid.

Assignees

• Tokyo Electron Ltd

Inventors

• Kaneko Hirofumi

Classifications

• H10P72/0441 Primary

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10P72/0434

  mainly by convection · CPC title

• F27B17/0025 Primary

  specially adapted for treating semiconductor wafers · CPC title

• H01L21/67126

  Electricity · mapped topic

• H01L21/67109

  Electricity · mapped topic