Conductive composition for thin film printing and method for forming thin film conductive pattern

Patent metadata

Field	Value
Publication number	US-9845404-B2
Application number	US-201415032388-A
Country	US
Kind code	B2
Filing date	Oct 28, 2014
Priority date	Oct 31, 2013
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

Provided are a conductive composition for thin film printing and a method for forming a thin film conductive pattern, which can easily performing thin film printing, and can capable of improve conductivity by thermal sintering at a comparatively low temperature of 300° C. or less or by photo irradiation. A conductive composition comprises metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 5 to 98% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×10 3 to 2×10 5 mPa·s. The composition is printed in a pattern having any selected shape on a substrate, by screen printing, and the pattern is subjected to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

First claim

The invention claimed is:

1. A conductive composition for thin film printing comprising metal particles, a binder resin, and a solvent, the content of an organic compound in the solvent being 24.5 to 74.8% by mass, the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group, the content of metal particles being 15 to 60% by mass, the metal particles containing 20% by mass or more of flat metal particles, the content of the binder resin being 0.5 to 10 parts by mass relative to 100 parts by mass of the metal particles, and the viscosity at 25° C. being 1.0×10 3 to 2×10 5 mPa·s.

2. A conductive composition for thin film printing according to claim 1 , wherein the organic compound comprising a hydrocarbon group having a bridged cyclic structure and a hydroxyl group is at least one of isobornylcyclohexanol, tricyclodecanedimethanol, or hydroxydicyclopentadiene.

3. A conductive composition for thin film printing according to claim 1 , wherein the metal particles contain 40% by mass or more of flat metal particles.

4. A conductive composition for thin film printing according to claim 1 wherein flat metal particle is a sliver flat particle having an aspect ratio (width/thickness of the flat metal particle) of 5 to 200.

5. A conductive composition for thin film printing according to claim 1 , wherein the metal particles are a mixture of a plurality of kinds of metal particles.

6. A conductive composition for thin film printing according to claim 5 , wherein the plurality of kinds of metal particles comprises flat particles and spherical nanoparticles.

7. A conductive composition for thin film printing according to claim 1 , wherein the binder resin is one selected from a group consisting of poly-N-vinylamide, polyalkylene glycol, polyurethane, a cellulose resin and its derivative, a polyester resin, a chlorinated polyolefin resin, a polyacrylic resin, a polyvinyl acetal (butyral) resin, an epoxy resin, an epoxy acrylate resin, a phenol resin, a melamine resin, and an urea resin.

8. A conductive composition for thin film printing according to claim 7 , wherein the poly-N-vinylamide is at least one selected from a group consisting of poly-N-vinylformamide, poly-N-vinyl acetamide, poly-N-vinylpyrrolidone, and poly-N-vinyl caprolactam, and a copolymer of a monomer of one of these and another vinyl compound; the polyalkylene glycol is at least one selected from a group consisting of polyethylene glycol, polypropylene glycol, a copolymer of ethylene glycol and propylene glycol, and polytetrahydrofuran; the cellulose resin is at least one selected from a group consisting of methyl cellulose, ethyl cellulose, hydroxy cellulose, methyl hydroxy cellulose, and cellulose acetate; and the epoxy resin is at least one selected from a group consisting of a bisphenol-A-type epoxy resin, a bisphenol-F-type epoxy resin, a novolak type epoxy resin, an aliphatic polyvalent epoxy resin, and an alicyclic glycidyl type polyvalent epoxy resin.

9. A conductive composition for thin film printing according to claim 7 , wherein the polyurethane is a reactant of at least one hydroxyl group containing compound and at least one isocyanate group containing compound; the hydroxyl group containing compound being at least one type of polyol selected from a group consisting of polyether polyol, polycarbonate polyol, and polyester polyol, at least one type of polyol selected from a group consisting of pentaerythritol, dipentaerythritol, trimethylolpropane, ditrimethylolpropane, and glycerin, or an ethylene oxide adduct and/or an propylene oxide adduct of a p-toluenesulfonic acid; and the isocyanate group containing compound being at least one selected from a group consisting of dicyclohexylmethane-4,4′-diisocyanate, isophorone diisocyanate, hexamethylene-1,6-diisocyanate, and tolylene diisocyanate.

10. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 1 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

11. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 2 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

12. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 3 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

13. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 4 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

14. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 5 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

15. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 6 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

16. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 8 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

17. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 8 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

18. A method for forming a thin film conductive pattern comprising a step of printing a pattern having any selected shape on a substrate, by screen printing, using a conductive composition for thin film printing according to claim 9 , and a step of subjecting the pattern to thermal sintering at a temperature of 300° C. or less and/or subjecting the pattern to pulsed light irradiation.

Assignees

• Showa Denko Kk

Inventors

• Uchida Hiroshi
• Wakabayashi Shoichiro
• Dou Jun
• Ono Takahiko
• KURITANI Masumi

Classifications

• C09D11/037

  characterised by the pigment · CPC title

• C09D11/52 Primary

  Electrically conductive inks · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title

• H05K2201/0245

  Flakes, flat particles or lamellar particles · CPC title

• C09D11/10

  based on artificial resins · CPC title