Method for manufacturing a component interconnect board

Patent metadata

Field	Value
Publication number	US-9839141-B2
Application number	US-201214239549-A
Country	US
Kind code	B2
Filing date	Aug 30, 2012
Priority date	Sep 6, 2011
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

There is provided a method for manufacturing a component interconnect board ( 150 ) comprising a conductor structure for providing electrical circuitry to at least one component ( 114 ) when mounted on the component board, the method comprising providing a conductor sheet ( 100 ) with a first predetermined pattern ( 115 ), providing a solder resist sheet ( 112 ) with a second predetermined pattern for defining solder areas ( 125 ) of the component board, forming a subassembly ( 120 ) by laminating the solder resist sheet on top of the conductor sheet, applying solder onto the subassembly, placing the at least one component onto the subassembly, performing soldering, and laminating the subassembly to a substrate ( 130 ). The solder resist sheet is further arranged to act as a carrier for the conductor sheet.

First claim

The invention claimed is:

1. A method for manufacturing a component interconnect board comprising a conductor structure for providing electrical circuitry to at least one component when mounted on said component interconnect board, said method comprising:
providing a pre-cut conductor sheet with a first predetermined pattern;
providing a pre-cut solder resist sheet with a second predetermined pattern for defining solder areas of said component interconnect board;
forming a subassembly by laminating said pre-cut solder resist sheet on top of said pre-cut conductor sheet;
applying solder onto said subassembly including said solder areas;
placing said at least one component onto said subassembly;
performing soldering with said at least one component onto said subassembly;
splitting said subassembly into a plurality of subassemblies; and
laminating at least one of the subassemblies to a substrate;
wherein, in said subassembly, said solder resist sheet is further arranged to act as a carrier for said conductor sheet.

2. A method according to claim 1 , further comprising cutting said subassembly to provide said conductor sheet with a final predetermined pattern corresponding to said conductor structure.

3. A method according to claim 1 , further comprising providing mechanical deformation of said subassembly by means of one of splitting, trimming of the subassembly to a predetermined contour, and stretching.

4. A method according to claim 1 , further comprising providing three dimensional deformation of said subassembly for providing one of: optical properties, mechanical fixation of said component interconnect board, mechanical fixation of additional components, thermal properties, and connector functionality.

5. A method according to claim 1 , wherein said substrate is flexible.

6. A method according to claim 1 , further providing mechanical deformation of said substrate by means of one of splitting, and trimming of the substrate to a predetermined contour.

7. A method according to claim 1 , wherein said conductor structure is further arranged to function as a connector.

8. A method according to claim 1 , wherein at least one of said first predetermined pattern, and said second predetermined pattern is done by means of cutting, punching, or slitting.

9. A method according to claim 1 , performed in a roll-to-roll process.

10. A method according to claim 1 , wherein said first predetermined pattern is provided with extractable conductor portions.

11. A method according to claim 1 , wherein said substrate is three dimensional.

Assignees

• Dingemans Antonius Petrus Marinus
• Philips Lighting Holding Bv

Inventors

• Dingemans Antonius Petrus Marinus

Classifications

• H10W90/00

  Package configurations · CPC title

• H05K3/303 Primary

  with surface mounted components (H05K3/32 takes precedence) · CPC title

• Y10T29/49144

  by metal fusion · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title

• H05K3/202

  using self-supporting metal foil pattern · CPC title