Thermal solutions for system-in-package assemblies in portable electronic devices
US-2015382448-A1 · Dec 31, 2015 · US
with surface mounted components (H05K3/32 takes precedence)
with surface mounted components (H05K3/32 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/303 |
| Official title | with surface mounted components (H05K3/32 takes precedence) |
| Display label | with surface mounted components (H05K3/32 takes precedence) |
| Total patents | 1,178 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 101 |
| 2016 | 115 |
| 2017 | 114 |
| 2018 | 140 |
| 2019 | 120 |
| 2020 | 150 |
| 2021 | 107 |
| 2022 | 98 |
| 2023 | 91 |
| 2024 | 70 |
| 2025 | 62 |
| 2026 | 10 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Stretchable electronic systems with containment chambers
US-2015373831-A1 · Dec 24, 2015 · US
Method for manufacturing light emitting diode backlight module
US-9220166-B2 · Dec 22, 2015 · US
Overvoltage protection circuit
US-9219473-B2 · Dec 22, 2015 · US
Low area over-head connectivity solutions to sip module
US-2015359099-A1 · Dec 10, 2015 · US
Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques
US-9209059-B2 · Dec 8, 2015 · US
Method and apparatus for fluid guided self-assembly of microcomponents
US-2015351253-A1 · Dec 3, 2015 · US
Thermally decomposable polymer compositions incorporating thermally activated base generators
US-2015337081-A1 · Nov 26, 2015 · US
Housing for electronic devices
US-2015342069-A1 · Nov 26, 2015 · US
Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US-2015334851-A1 · Nov 19, 2015 · US
Anisotropic conductive film and method of producing the same
US-2015319867-A1 · Nov 5, 2015 · US
Power module substrate, power module substrate with heat sink, power module, method of producing power module substrate, paste for copper sheet bonding, and method of producing bonded body
US-2015313011-A1 · Oct 29, 2015 · US
Electronic component mounting system and electronic component mounting method
US-2015305213-A1 · Oct 22, 2015 · US
Method of mounting electronic component
US-9167701-B2 · Oct 20, 2015 · US
Circuit board
US-9161432-B2 · Oct 13, 2015 · US
Module for facilitating positioning of electronic components
US-2015289375-A1 · Oct 8, 2015 · US
Electric circuit on flexible substrate
US-2015282341-A1 · Oct 1, 2015 · US
Method for manufacturing LED device with structure for precisely locating LEDs thereon
US-9147796-B2 · Sep 29, 2015 · US
Electronic textile and method of manufacturing an electronic textile
US-9148949-B2 · Sep 29, 2015 · US
Electronic component mounting system and electronic component mounting method
US-2015271963-A1 · Sep 24, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/303?
- CPC H05K3/303 is the Cooperative Patent Classification code for “with surface mounted components (H05K3/32 takes precedence).”
- How many patents are filed under CPC H05K3/303 (with surface mounted components (H05K3/32 takes precedence))?
- Our database includes 1,178 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/303 growing?
- Publication counts under this code: 70 in 2024 vs 62 in 2025 (latest complete years).