Circuit board and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016302299-A1
Application number	US-201614990464-A
Country	US
Kind code	A1
Filing date	Jan 7, 2016
Priority date	Apr 8, 2015
Publication date	Oct 13, 2016
Grant date	—

Abstract

A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

First claim

What is claimed is:

1 . A circuit board comprising:
an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each comprise: a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

2 . The circuit board as set forth in claim 1 , wherein adjacent heat-dissipating members of the plurality of heat-dissipating members are coupled through the insulating part thereof in contact with one another.

3 . The circuit board as set forth in claim 1 , the metal wire of at least one of the plurality of heat-dissipating members has a top surface and a bottom surface thereof exposed through a top surface and a bottom surface of the heat-transfer structure, respectively.

4 . The circuit board as set forth in claim 3 , further comprising:
a first via and a second via insulated from each other and each comprising one surface thereof in contact with the top surface of the heat-transfer structure; and a third via and a fourth via insulated from each other and each comprising one surface thereof in contact with the bottom surface of the heat-transfer structure, wherein the first via is electrically connected to the third via, and the second via is electrically connected to the fourth via.

5 . The circuit board as set forth in claim 4 , wherein the first via is connected to the third via through heat-dissipating members, and the second via is connected to the fourth via through different heat-dissipating members.

6 . A circuit board comprising:
an insulating material; and a heat-transfer structure inserted in the insulating material, wherein the heat-transfer structure comprises:
a first heat-dissipating member comprising a first insulating part disposed on an outer surface of a first metal wire; and
a second heat-dissipating member comprising a second insulating part disposed on an outer surface of a second metal wire.

7 . The circuit board as set forth in claim 6 , further comprising:
a first via comprising one surface thereof in contact with a top surface of the first metal wire; a second via comprising one surface thereof in contact with a top surface of the second metal wire; a third via comprising one surface thereof in contact with a bottom surface of the first metal wire; and a fourth via comprising one surface thereof in contact with a bottom surface of the second metal wire.

8 . The circuit board as set forth in claim 7 , wherein a connection between the first metal wire and the first via, a connection between the second metal wire and the second via, a connection between the first metal wire and the third via, or a connection between the second metal wire and the fourth via, or any combination thereof, is made through a circuit pattern.

9 . The circuit board as set forth in claim 6 , further comprising:
a first circuit pattern comprising one surface thereof in contact with a top surface of the first metal wire; a second circuit pattern comprising one surface thereof in contact with a top surface of the second metal wire; a third circuit pattern comprising one surface thereof in contact with a bottom surface of the first metal wire; a fourth circuit pattern comprising one surface thereof in contact with a bottom surface of the second metal wire; a first via comprising one surface thereof in contact with another surface of the first circuit pattern; a second via comprising one surface thereof in contact with another surface of the second circuit pattern; a third via comprising one surface thereof in contact with another surface of the third circuit pattern; and a fourth via comprising one surface thereof in contact with another surface of the fourth circuit pattern.

10 . The circuit board as set forth in claim 6 , further comprising: a second heat-transfer structure disposed on the circuit board, thermally connected to the heat-transfer structure.

11 . The circuit board as set forth in claim 10 , further comprising an electronic component configured to generate heat during operation, wherein the heat-transfer structure is configured to transfer heat away from the electronic component to the second heat-transfer structure through a plurality of vias.

12 . A method of manufacturing a circuit board, comprising:
forming a heat-transfer structure by coupling a plurality of heat-dissipating members with one another, the heat-dissipating members each comprising an insulating part disposed on an outer circumferential surface of a metal wire; inserting the heat-transfer structure into a cavity disposed in a first insulating layer; forming a second insulating layer covering the first insulating layer and the heat-transfer structure; and forming a via, penetrating the second insulating layer, in contact with the heat-transfer structure.

13 . The method as set forth in claim 12 , wherein the forming of the via comprises:
forming a first via and a second via insulated from each other and each comprising one surface thereof in contact with a top surface of the heat-transfer structure; and forming a third via and a fourth via insulated from each other and each comprising one surface thereof in contact with a bottom surface of the heat-transfer structure, wherein the first via is electrically connected with the third via and the second via is electrically connected with the fourth via.

14 . The method as set forth in claim 12 , further comprising forming a circuit pattern on one surface of the heat-transfer structure, after inserting the heat-transfer structure into the cavity disposed in the first insulating layer and before forming the second insulating layer covering the first insulating layer and the heat-transfer structure.

Assignees

• Samsung Electro Mech

Inventors

• Lee Young-Kwan
• Chung Yul-Kyo
• Lee Seung-Eun
• Sung Ki-Jung

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H05K1/0206 Primary

  by printed thermal vias · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/42

  Plated through-holes {or plated via connections} · CPC title

• H05K1/0298

  Multilayer circuits · CPC title