Apparatus and method for indirectly cooling superconducting quantum interference device

Patent metadata

Field	Value
Publication number	US-9823312-B2
Application number	US-201514692258-A
Country	US
Kind code	B2
Filing date	Apr 21, 2015
Priority date	Oct 29, 2012
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

An apparatus and a method for indirectly cooling a superconducting quantum interference device (SQUID) are provided. The apparatus includes an outer container extending in a vertical direction; a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate; a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container; a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module; a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and a heat conduction plate being in thermal contact with the other end of the heat transfer pillar.

First claim

What is claimed is:

1. An apparatus for indirectly cooling a superconducting quantum interference device (SQUID), comprising:
an outer container extending in a vertical direction;
a metallic inner container inserted into the outer container to store a liquid coolant, the metal inner container including a top plate;
a SQUID sensor module disposed between a bottom surface of the outer container and a bottom surface of the inner container;
a heat transfer pillar adapted to cool the SQUID sensor module, the heat transfer pillar having one end connected to the bottom surface of the inner container and the other end directly or indirectly connected to the SQUID sensor module;
a magnetic shield part formed of a superconductor covering a top surface of the SQUID sensor module; and
a heat conduction plate being in thermal contact with the other end of the heat transfer pillar, the heat conduction plate being stacked on a top surface of the magnetic shield part,
wherein the inner container has a space spaced apart from the outer container and a space between the inner container and the outer container is in a vacuum state.

2. The apparatus as set forth in claim 1 , further comprising:
an auxiliary heat transfer layer disposed to a bottom surface of the SQUID sensor module.

3. The apparatus as set forth in claim 2 , wherein the auxiliary heat transfer layer is formed of a copper mesh, and
wherein wefts and warps of the copper mesh are electrically insulated from each other.

4. The apparatus as set forth in claim 2 , wherein the auxiliary heat transfer layer comprises:
an epoxy layer; and
copper conductor lines stacked on the epoxy layer and extending parallel with each other at regular intervals.

5. The apparatus as set forth in claim 2 , further comprising:
a fixing ring formed of a conductor to fix the auxiliary heat transfer layer to the bottom surface of the inner container.

6. The apparatus as set forth in claim 1 , further comprising:
a fixing block formed of a copper material and fixed to the bottom surface of the inner container to transfer heat to the heat transfer pillar.

7. The apparatus as set forth in claim 1 , wherein the outer container comprises:
an upper outer cylinder;
a washer-shaped outer middle plate connected to a bottom surface of the upper outer cylinder;
a lower outer cylinder being in contact with an inner side surface of the outer middle plate to vertically extend; and
an outer base plate disposed on a bottom surface of the lower outer cylinder.

8. The apparatus as set forth in claim 1 , wherein the inner container comprises:
a neck portion connected to an inner side surface of a through-hole formed in the center of a top plate, the neck portion extending vertically;
a washer-shaped inner middle plate connected to a bottom surface of the neck portion, the inner middle plate having a through-hole in its center;
a cylindrical inner body portion extending vertically from an outer side surface of the inner middle plate; and
an inner base plate disposed on a bottom surface of the inner body portion.

9. The apparatus as set forth in claim 1 , wherein the SQUID sensor module comprises:
a sensor coupling plate formed of a dielectric material;
sensor fixing blocks mounted on a bottom surface of the sensor coupling plate; and
SQUID sensors coupled with the sensor fixing blocks.

10. The apparatus as set forth in claim 1 , wherein the magnetic shield part is formed of lead (Pb) or niobium (Nb).

11. The apparatus as set forth in claim 1 , wherein the heat conduction plate and the heat transfer pillar are formed of an oxygen-free copper material.

12. The apparatus as set forth in claim 1 , wherein the magnetic shield part extends vertically to cover the SQUID sensor module.

13. The apparatus as set forth in claim 1 , further comprising:
a first support plate coupled with an outer side surface of the inner container, the first support plate having a first diameter and including a first conductive thermal anchor formed on its outer circumferential surface;
a second support plate spaced vertically apart from the first support plate to be coupled with the outer side surface of the inner container, the second support plate having a second diameter smaller than the first diameter and including a second conductive thermal anchor formed on its outer circumferential surface;
a third support plate spaced vertically apart from the second support plate to be coupled with the outer side surface of the inner container, the second support plate having a third diameter smaller than the second diameter and including a third conductive thermal anchor formed on its outer circumferential surface;
a first thermal shield part coupled with the first thermal anchor and extending vertically;
a second thermal shield part coupled with the second thermal anchor and extending vertically; and
a third thermal shield part coupled with the third thermal anchor and extending vertically.

14. A method for indirectly cooling a superconducting quantum interference device (SQUID), comprising:
providing an outer container extending vertically and a metallic inner container inserted into the outer container to store a liquid coolant, the inner container including a top plate and a space between the inner container and the outer container being in a vacuum state;
providing a SQUID sensor module between a bottom surface of the outer container and a bottom surface of the inner container;
providing a heat transfer pillar having one end connected to the bottom surface of the inner container and the other end connected directly or indirectly to the SQUID sensor module to cool the SQUID sensor module;
providing a magnetic shield with a superconductor disposed to cover a portion of the SQUID sensor module; and
providing a heat conduction plate being in thermal contract with the other end of the heat transfer pillar and being adapted to cool the superconductor.

15. The method as set forth in claim 14 , further comprising:
providing an auxiliary heat transfer layer covering a bottom surface of the SQUID sensor module to cool the heat transfer pillar, the superconductor, and the SQUID sensor module.

Assignees

• Korea Res Inst Standards & Sci

Inventors

• Yu Kwon-Kyu
• Lee Yong-Ho
• Kim Kiwoong
• Kwon Hyukchan
• Kim Jin-Mok
• Lee Sang-Kil

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• G01R33/0354

  SQUIDS · CPC title

• G01R33/007 Primary

  Environmental aspects, e.g. temperature variations, radiation, stray fields (G01R33/025 takes precedence) · CPC title

• G01R1/18

  Screening arrangements against electric or magnetic fields, e.g. against earth's field · CPC title