Wafer testing probe card

Patent metadata

Field	Value
Publication number	US-9823272-B2
Application number	US-201414162766-A
Country	US
Kind code	B2
Filing date	Jan 24, 2014
Priority date	Jan 28, 2013
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

First claim

What is claimed is:

1. A wafer testing probe card, comprising:
a printed circuit board;
a flexible circuit board having peripheral portions electrically connected to the printed circuit board and collectively defining an accommodation space, and the flexible circuit board having an upper surface and a lower surface;
an elastic piece disposed within the accommodation space defined collectively by the printed circuit board and the flexible circuit board; and
a probe unit, comprising:
a probe head fixed on the printed circuit board and having a plurality of through holes; and
a plurality of probes respectively passing through the through holes, wherein the probes in direct contact with the lower surface of the flexible circuit board with the support of the elastic piece against the upper surface of the flexible circuit board when the probes moves toward the flexible circuit board, thereby enabling signals to be transmitted from a device under test to the printed circuit board via the flexible circuit board and the probes; wherein

as the probes moves toward the flexible circuit board, the elastic piece absorbs the forces of the probes transmitted through the flexible circuit board; and
the elastic piece and the probes are physically spaced from each other by the flexible circuit board such that the elastic piece is incapable of contacting the probes.

2. The wafer testing probe card of claim 1 , wherein lengths of the probes are the same.

3. The wafer testing probe card of claim 1 , wherein lengths of the probes gradually increase from a periphery of the elastic piece to a center of the elastic piece.

4. The wafer testing probe card of claim 1 , wherein a thickness of the elastic piece gradually increases from a periphery of the elastic piece to a center of the elastic piece.

5. The wafer testing probe card of claim 1 , wherein the probe head comprises a holder and a plurality of screws, wherein the holder is fixed to the printed circuit board by the screws.

6. The wafer testing probe card of claim 1 , wherein the probe head comprises an insulated substrate having the through holes.

7. The wafer testing probe card of claim 6 , wherein each of the probes comprises a probe body and a stopper connected to one end of the probe body, wherein the stopper is disposed between the flexible circuit board and the insulated substrate, and an outer diameter of the stopper is larger than an inner diameter of the through holes, so as to prevent the probes from being detached from the through holes.

8. The wafer testing probe card of claim 7 , wherein lengths of the stoppers gradually increase from a periphery of the elastic piece to a center of the elastic piece.

9. The wafer testing probe card of claim 7 , wherein materials of the probe bodies and the stoppers are conductors.

10. The wafer testing probe card of claim 7 , wherein materials of the probe bodies are conductors, materials of the stoppers are nonconductors, and two ends of the probe bodies are both exposed from the stoppers.

11. The wafer testing probe card of claim 1 , wherein the probe head comprises an upper insulated substrate having the through holes and a lower insulated substrate having the through holes.

12. The wafer testing probe card of claim 11 , wherein each of the probes comprises a probe body and a stopper disposed on a middle section of the probe body, wherein the stopper is disposed between the upper insulated substrate and the lower insulated substrate, and an outer diameter of the stopper is larger than an inner diameter of the through holes, so as to prevent the probes from being detached from the through holes.

13. The wafer testing probe card of claim 12 , wherein materials of the probe bodies and the stoppers are conductors.

14. The wafer testing probe card of claim 12 , wherein materials of the probe bodies are conductors, materials of the stoppers are nonconductors, and two ends of the probe bodies are both exposed from the stoppers.

15. The wafer testing probe card of claim 1 , wherein the probes are straight needles.

16. The wafer testing probe card of claim 1 , wherein the printed circuit board includes an opening, and the elastic piece is disposed in the opening.

Assignees

• Mpi Corp

Inventors

• Chen Ming-Chi
• Li Tien-Chia
• Yeh Dai-Jin
• Chen Tsung-Yi
• Wang Chien-Kuei

Classifications

• G01R1/07314

  the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support (on an elastic support, e.g. a film, G01R1/0735) · CPC title

• G01R1/0735 Primary

  arranged on a flexible frame or film · CPC title

• G01R1/06733

  Geometry aspects (G01R1/06727 takes precedence) · CPC title