Wafer test apparatus

Patent metadata

Field	Value
Publication number	US-9696369-B2
Application number	US-201414565946-A
Country	US
Kind code	B2
Filing date	Dec 10, 2014
Priority date	Feb 6, 2014
Publication date	Jul 4, 2017
Grant date	Jul 4, 2017

Abstract

A wafer test apparatus includes a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test. A test head is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer. A probe card horizontality adjustment unit is positioned between the test head and the probe card and adjusts horizontality of the probe card during the wafer test.

First claim

What is claimed is:

1. A wafer test apparatus comprising:
a probe station comprising a probe card that contacts a wafer positioned on a chuck during a wafer test;
a test head that is disposed on the probe card and tests electrical characteristics of a semiconductor chip positioned on the wafer; and
a probe card horizontality adjustment unit positioned between the test head and the probe card that adjusts horizontality of the probe card during the wafer test,
wherein the probe card horizontality adjustment unit comprises:
an inner circumferential body having a through-hole,
an outer circumferential body disposed about an outer circumferential surface of the inner circumferential body,
a plurality of connection portions that connect the inner circumferential body and the outer circumferential body about the through-hole, and
a probe card weight adjustment member that is provided on each of the plurality of connection portions and adjusts a force applied to the probe card.

2. The wafer test apparatus of claim 1 , wherein the plurality of connection portions are provided opposite each other about the through-hole,
wherein the probe card weight adjustment member is provided on the plurality of connection portions opposite each other about the through-hole.

3. The wafer test apparatus of claim 1 , wherein the probe card weight adjustment member comprises a plurality of spring members that are provided on the plurality of connection portions.

4. The wafer test apparatus of claim 1 , wherein the probe card weight adjustment member comprises a probe card weight sensor that measures the force applied to the probe card and a probe card actuator that adjusts the horizontality of the probe card.

5. The wafer test apparatus of claim 4 , wherein a weight data electrical signal of the probe card weight sensor is input to a weight controller that is provided in the test head, the weight data electrical signal that is input to the weight controller being input to a flow rate controller that is provided in the test head, and the flow rate controller adjusting the probe card actuator according to the weight data electrical signal.

6. The wafer test apparatus of claim 1 , wherein the test head comprises:
a support plate that has a bottom surface supporting the probe card that contacts the wafer during the wafer test;
a circuit board that is provided on a top surface of the support plate and transmitting an electrical signal for test to the probe card; and
a connection plate that is provided on a top surface of the circuit board and is connected to the support plate through a connection pillar that passes through the circuit board.

7. The wafer test apparatus of claim 5 , wherein a guide member that guides only a vertical movement of the support plate is provided on an outer circumferential surface of the connection pillar.

8. The wafer test apparatus of claim 6 , wherein a circuit board horizontality adjustment unit that adjusts the horizontality of the circuit board connected to the probe card during the wafer test is provided on the connection plate.

9. The wafer test apparatus of claim 8 , wherein the circuit board horizontality adjustment unit comprises a circuit board weight adjustment member that is provided on the connection plate and adjusts a weight of the probe card.

10. The wafer test apparatus of claim 9 , wherein the circuit board weight adjustment member comprises a circuit board weight sensor that is provided on the connection plate and measures a weight applied to the circuit board, and a spring member that is disposed on the circuit board weight sensor.

11. The wafer test apparatus of claim 9 , wherein the circuit board weight adjustment member comprises a circuit board weight sensor that is provided on the connection plate and measures a weight applied to the circuit board, and a circuit board actuator that adjusts horizontality of the circuit board.

12. The wafer test apparatus of claim 1 , wherein the test head comprises:
a support plate comprising a probe having a cantilever structure that contacts the wafer during the wafer test;
a circuit board that is provided on a top surface of the support plate and transmits an electrical signal for test to the probe card; and
a connection plate that is provided on a top surface of the circuit board and is connected to the support plate through a connection pillar that passes through the circuit board,
wherein the support plate functions as the probe card during the wafer test.

13. A wafer test apparatus comprising:
a probe station comprising a probe card that contacts a wafer placed on a chuck during a wafer test;
a test head disposed on the probe card and that transmits an electrical signal for test to the probe card;
a circuit board horizontality adjustment unit positioned on the circuit board of the test head and constructed and arranged to adjust horizontality of the circuit board during the wafer test; and
a probe card horizontality adjustment unit positioned under the test head and constructed and arranged to adjust horizontality of the probe card during the wafer test,
wherein the probe card horizontality adjustment unit comprises:
an inner circumferential body having a through-hole,
an outer circumferential body disposed about an outer circumferential surface of the inner circumferential body,
a plurality of connection portions that connect the inner circumferential body and the outer circumferential body about the through-hole, and
a probe card weight adjustment member that is provided on each of the plurality of connection portions and adjusts a force applied to the probe card.

14. A probe card horizontality adjustment unit for a test apparatus, comprising:
an upper portion constructed and arranged to contact a test head of the test apparatus;
a lower portion constructed and arranged to contact a probe card of the test apparatus; and
a horizontality adjustment unit positioned at least one of the lower portion and upper portion that adjusts horizontality of a force applied to the probe card by the test head,
wherein the horizontality adjustment unit comprises:
a plurality of probe card force sensors that detect forces applied to the probe card by the test head at positions corresponding to the probe card force sensors, and
a plurality of probe card actuators that adjust the horizontality of the probe card in response to the detected forces.

15. The probe card horizontality adjustment unit of claim 14 wherein the horizontality adjustment unit comprises a plurality of spring members arranged at the at least one of the lower portion and upper portion.

16. The probe card horizontality adjustment unit of claim 14 further comprising a force controller that receives force signals corresponding to the forces, and, in response to the received force signals, generates actuator signals for controlling the probe card actuators.

17. The probe card horizontality adjustment unit of claim 14 further comprising:
an inner circumferential body between the upper portion and lower portion having an opening;
an outer circumferential body disposed about the inner circumferential body; and
a plurality of connection portions that connect the inner circumferential body and the outer circumferential body about the opening,
wherein the horizontality adjustment unit is provided on the plurality of connection portions.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Woo-Kyu
• Hwang In-Seok
• Kil Jong-Koo
• Kim In-Ki

Classifications

• G01R1/07378

  using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence) · CPC title

• G01R31/2889

  Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence) · CPC title

• G01R1/073

  Multiple probes · CPC title

• G01R31/2601 Primary

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R31/02

  Physics · mapped topic