Membrane probe card

Patent metadata

Field	Value
Publication number	US-9709599-B2
Application number	US-201414151208-A
Country	US
Kind code	B2
Filing date	Jan 9, 2014
Priority date	Jan 9, 2014
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

An apparatus includes a membrane film and a plurality of needle tips with cylinder shapes. The membrane film includes a plurality of signal traces. The needle tips are disposed on the membrane film and are electrically connected to the signal traces. The needle tips are configured to probe a device-under-test (DUT).

First claim

What is claimed is:

1. An apparatus comprising:
a fixture, wherein the fixture comprises a metal portion, a plastic portion, and a hard plate, and the plastic portion is disposed between the metal portion and the hard plate, wherein the metal portion of the fixture comprises at least one opening;
a membrane film comprising a plurality of signal traces;
a plurality of needle tips disposed on the membrane film and electrically connected to the signal traces, wherein the needle tips are configured to probe a device-under-test (DUT), the needle tips are wholly cylindrical, and at least one portion of the membrane film is attached to the fixture through a buffer layer that has a compressive compliance and resilience; and
a printed circuit board, wherein the fixture and the printed circuit board are fastened by at least one screw passing through the at least one opening of the metal portion of the fixture.

2. The apparatus as claimed in claim 1 , wherein the buffer layer is made by using silicon rubber.

3. The apparatus as claimed in claim 1 further comprising a printed circuit board (PCB), wherein the fixture is attached to the PCB, and the needle tips are electrically connected to the PCB via the signal traces.

4. The apparatus as claimed in claim 1 , wherein the needle tips comprise a first-type tip and a second-type tip, and quality-factors of the first-type tip and the second-type tip are different.

5. The apparatus as claimed in claim 4 , wherein the first-type tip is fabricated by using copper, and the second-type tip is fabricated by using nickel.

6. The apparatus as claimed in claim 1 , wherein at least one of the needle tips is fabricated by using copper.

7. The apparatus as claimed in claim 1 , wherein at least one portion of the membrane film is attached to the metal portion through the buffer layer.

8. The apparatus as claimed in claim 1 , wherein at least one portion of the membrane film is adhered to the hard plate of the fixture through a UV adhesive.

9. An apparatus comprising:
a printed circuit board (PCB) comprising a plurality of signal channels;
a membrane core comprising:
a buffer layer has a compressive compliance and resilience;
a fixture attached to the PCB, wherein the fixture comprises a metal portion, a plastic portion, and a hard plate, and the plastic portion is disposed between the metal portion and the hard plate, wherein the metal portion of the fixture comprises at least one opening, and the fixture and the printed circuit board are fastened by at least one screw passing through the at least one opening of the metal portion of the fixture;
a membrane film attached to the fixture through the buffer layer, wherein the membrane film comprises a plurality of signal traces, the signal traces are electrically connected to the signal channels of the PCB through a plurality of connectors respectively, and the signal traces are configured to receive testing signals from the signal channels; and
a plurality of needle tips disposed on the membrane core and electrically connected to the signal traces of the membrane film, wherein the needle tips are configured to receive the testing signals and provide the testing signals to a device-under-test (DUT), and the needle tips are wholly cylindrical.

10. The apparatus as claimed in claim 9 , wherein the buffer layer is fabricated by using silicon rubber.

11. The apparatus as claimed in claim 9 , wherein the buffer layer has a compressive compliance.

12. The apparatus as claimed in claim 9 , wherein the needle tips comprise:
a voltage controlled oscillator (VCO) inductor tip having a first quality-factor; and
a non-VCO-inductor tip having a second quality-factor;
wherein the first quality-factor is larger than the second quality-factor.

13. The apparatus as claimed in claim 12 , wherein the VCO-inductor tip and the non-VCO-inductor tip are made by using different materials.

14. The apparatus as claimed in claim 13 , wherein the VCO-inductor tip is made by using copper and the non-VCO-inductor tip is made by using nickel.

15. A method comprising:
disposing a plurality of needle tips on a membrane film comprising a plurality of signal traces, wherein the plurality of needle tips with cylinder shapes are electrically connected to the signal traces, and the needle tips are wholly cylindrical;
attaching at least one portion of the membrane film to a fixture through a buffer layer that has a compressive compliance and resilience, wherein the fixture comprises a metal portion, a plastic portion, and a hard plate, and the plastic portion is disposed between the metal portion and the hard plate, wherein the metal portion of the fixture comprises at least one opening; and
fastening the fixture and a printed circuit board by at least one screw passing through the at least one opening of the metal portion of the fixture.

16. The method as claimed in claim 15 , further comprising:
fabricating the buffer layer by using silicon rubber.

17. The method as claimed in claim 15 , wherein disposing the needle tips with cylinder shapes on the membrane film comprises:
disposing a VCO-inductor tip having a first quality-factor on the membrane film; and
disposing a non-VCO-inductor tip having a second quality-factor on the membrane film;
wherein the first quality-factor is larger than the second quality-factor.

18. The method as claimed in claim 17 , further comprising:
fabricating the VCO-inductor tip by using copper; and
fabricating the non-VCO-inductor tip by using nickel.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hsu Ming-Cheng

Classifications

• G01R31/2601 Primary

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R1/0416 Primary

  Connectors, terminals (G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364) · CPC title

• G01R31/2886

  Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06) · CPC title

• G01R1/0735

  arranged on a flexible frame or film · CPC title