Curable compositions

Patent metadata

Field	Value
Publication number	US-9822214-B2
Application number	US-201414907439-A
Country	US
Kind code	B2
Filing date	Jul 24, 2014
Priority date	Jul 24, 2013
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

Embodiments include curable compositions including an epoxy resin and a hardener component including a polymer having first constitutional unit, a second constitutional unit, and a third constitutional unit, where the epoxy group to the second constitutional unit has a molar ratio in a range of 0.5:1 to 5:1. Embodiments include prepregs that include a reinforcement component and the curable composition and an electrical laminate formed with the curable composition.

First claim

What is claimed:

1. A curable composition, comprising:
an epoxy resin; and
a hardener compound for curing with the epoxy resin, the hardener compound comprising:
a polymer comprising a first constitutional unit having a formula of

and a second constitutional unit having a formula of

and a third constitutional unit having a formula selected from the group consisting of

wherein each m, n, and r is independently a real number that represents a mole fraction of the respective constitutional unit in the polymer, each R is independently a hydrogen, a halogen, an aromatic group or an aliphatic group, M+ and M2+ are metal ions and wherein the molar ratio of the epoxy group to the second constitutional unit is in the range of from 0.5:1 to 5:1.

2. The curable composition of claim 1 , further comprising a fourth constitutional unit having a formula of

wherein p is a real number that represents a mole fraction of the fourth constitutional unit in the polymer, and Ar is an aromatic group.

3. The curable composition of claim 1 wherein at least a portion of the second constitutional unit is converted to an imide or an amic acid by treatment with an amine-containing compound.

4. The curable composition of claim 1 , where the third constitutional unit constitutes 0.005% to 10% by weight of the polymer.

5. The curable composition of claim 1 , wherein the ratio of r/(n+r) or r/(n+p+r) is in the range from 0.001 to 0.1.

6. The curable composition of claim 1 , further comprising a flame retardant.

7. The curable composition claim 1 , of wherein said first constitutional unit is styrene.

8. The curable composition of claim 1 , wherein said second constitutional unit is maleic anhydride.

9. The curable composition of claim 1 , wherein the metal ion is selected from the group consisting of sodium, potassium, lithium, and zinc.

10. The curable composition of claim 1 , wherein the metal ion is obtained from a base compound selected from the group consisting of sodium hydroxide, sodium carbonate, sodium acetate, zinc acetate, lithium hydroxide, potassium carbonate, potassium chloride, and potassium hydroxide.

11. The curable composition of claim 1 , where a cured product of the curable composition has a glass transition temperature of at least 150° C.

12. The curable composition of claim 1 , where the first constitutional unit to the second constitutional unit has a molar ratio in a range of 1:1 to 20:1.

13. The curable composition of claim 1 , where the second constitutional unit constitutes 0.1 percent (%) to 49% by weight of the polymer.

14. The curable composition of claim 1 , where the epoxy resin is selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof.

15. A prepreg comprising a reinforcement component and the curable composition of claim 1 .

16. An electrical laminate structure that comprises a reaction product of the curable composition of claim 1 .

17. The curable composition of claim 1 , wherein said first constitutional unit is styrene and said second constitutional unit is maleic anhydride.

18. The curable composition of claim 17 , wherein a cured product of the curable composition has a glass transition temperature of at least 150° C. and where the first constitutional unit to the second constitutional unit has a molar ratio in a range of 1:1 to 20:1.

19. A method of preparing a curable composition, comprising:
providing an epoxy resin; and

reacting the epoxy resin with a hardener compound, the hardener compound comprising:
a polymer comprising a first constitutional unit with a formula of

a second constitutional unit having a formula of

and a third constitutional unit having a formula selected from the group consisting of

wherein each m, n, and r is independently a real number that represents a mole fraction of the respective constitutional unit in the polymer, each R is independently a hydrogen, a halogen, an aromatic group or an aliphatic group, M+ and M2+ are metal ions and wherein the molar ratio of the epoxy group to the second constitutional unit is in the range of from 0.5:1 to 5:1.

20. The method of claim 19 , wherein the hardener compound further comprises a fourth constitutional unit having a formula of

wherein p is a real number that represents a mole fraction of the fourth constitutional unit in the polymer, and Ar is an aromatic group.

Assignees

• Blue Cube Ip Llc

Inventors

• Ye Simon
• Xiao Tianhui
• Chen Hongyu
• Mullins Michael J
• Cai Yu
• Xiong Jiawen
• Storer Joey W
• Wilson Mark B
• Gong Frank Y

Classifications

• C08G59/4261

  Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings (C08G59/4253 takes precedence) · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08J2425/08

  Copolymers of styrene (C08J2429/08, C08J2435/06, C08J2455/02 take precedence) · CPC title

• C08J2363/00

  Characterised by the use of epoxy resins; Derivatives of epoxy resins · CPC title

• C08L35/06

  Copolymers with vinyl aromatic monomers · CPC title