Methods and apparatuses for laser processing materials

Patent metadata

Field	Value
Publication number	US-9815144-B2
Application number	US-201514794181-A
Country	US
Kind code	B2
Filing date	Jul 8, 2015
Priority date	Jul 8, 2014
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

First claim

What is claimed is:

1. A method of laser processing a transparent material, the method comprising:
positioning the transparent material on a carrier; and
transmitting a laser beam through the transparent material, the laser beam incident on a side of the transparent material opposite the carrier, wherein
the transparent material is substantially transparent to the laser beam;
the carrier comprises a support base and a laser disruption element;
the laser disruption element optically disrupts the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity below the laser disruption element to damage the support base; and
the laser disruption element comprises frosted glass.

2. The method of claim 1 , wherein at least a portion of the carrier is non-transparent to the laser beam.

3. The method of claim 1 , wherein the laser disruption element is not damaged by the laser beam transmitted through the transparent material.

4. The method of claim 1 , wherein the transparent material is glass.

5. The method of claim 1 , further comprising perforating the transparent material with the laser beam incident on the transparent material.

6. The method of claim 1 , wherein the laser beam has a pulse duration between about 1 picosecond and about 100 picoseconds.

7. The method of claim 1 , wherein the laser beam has a pulseburstrepetition rate of between about 1 kHz and 2 MHz and each pulse burst has at least two pulses.

8. The method of claim 1 , wherein the laser disruption element comprises a roughened surface that optically disrupts the laser beam.

9. The method of claim 8 , wherein an average roughness (Ra) of the roughened surface is greater than or equal to about 0.5 microns.

10. The method of claim 8 , wherein the roughened surface is the surface of the laser disruption element nearest the transparent material.

11. The method of claim 1 , wherein the laser disruption element is a substantially flat sheet.

12. The method of claim 1 , wherein the laser disruption element is translucent.

13. The method of claim 1 , wherein the pulsed laser has laser power of 10 W-150 W and produces pulse bursts with at least 2 pulses per pulse burst.

14. The method of claim 13 , wherein the pulsed laser has laser power of 10 W-100 W and produces pulse bursts with at least 2-25 pulses per pulse burst.

15. The method of claim 13 , wherein the pulsed laser has laser power of 25 W-60 W, and produces pulse bursts with at least 2-25 pulses per burst and the periodicity between the defect lines is 2-20 microns.

16. A method of protecting a carrier when laser processing a transparent material positioned on the carrier, the method comprising:
positioning the transparent material on top of the carrier, the carrier comprising a support base;
transmitting a laser beam through the transparent material, wherein the laser beam is incident on a surface of the transparent material opposite the carrier, the laser beam comprising a focal area having an intensity sufficient to damage the carrier; and
positioning a laser disruption element between the support base and the transparent material, the laser disruption element optically disrupting the laser beam transmitted through the transparent material such that the laser beam does not have sufficient intensity at any point below the laser disruption element to damage the support base, wherein the laser disruption element comprises frosted glass.

17. The method of claim 16 , wherein the laser disruption element comprises a roughened surface that optically disrupts the laser beam.

18. The method of claim 17 , wherein an average roughness (Ra) of the roughened surface is greater than or equal to about 0.5 microns.

19. The method of claim 16 , wherein the pulsed laser has laser power of 10 W-150 W and produces pulse bursts with at least 2 pulses per pulse burst.

20. The method of claim 19 , wherein the pulsed laser has laser power of 10 W-100 W and produces pulse bursts with at least 2-25 pulses per pulse burst.

21. The method of claim 19 , wherein the pulsed laser has laser power of 25 W-60 W, and produces pulse bursts with at least 2-25 pulses per burst and the periodicity between the defect lines is 2-20 microns.

Assignees

• Corning Inc

Inventors

• Grundmueller Richard
• Herrnberger Frank Fabian
• Klein Michael
• Spaeth Florian

Classifications

• B23K26/57 Primary

  the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming · CPC title

• B23K2203/56

  Operations & Transport · mapped topic

• B23K2203/54

  Operations & Transport · mapped topic

• C03B33/102

  involving a focussed radiation beam, e.g. lasers · CPC title

• C03B33/0222 Primary

  Scoring using a focussed radiation beam, e.g. laser · CPC title