Epoxy resin composition and light-emitting apparatus using the same

Patent metadata

Field	Value
Publication number	US-9812618-B2
Application number	US-201414768108-A
Country	US
Kind code	B2
Filing date	Feb 10, 2014
Priority date	Feb 14, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

An epoxy resin composition provided according to one embodiment of the present invention includes: a triazine derivative epoxy compound; a siloxane compound including a cycloaliphatic epoxy group and a siloxane group; and a curing agent, where the epoxy resin composition includes 10 to 70 parts by weight of the siloxane group with respect to 100 parts by weight of the siloxane compound, thereby providing a composition excellent in heat resistance, light resistance, and excess moisture tolerance, with good shear adhesion to silicone, and capable of semi-solidification.

First claim

The invention claimed is:

1. An epoxy resin composition comprising:
a triazine derivative epoxy compound;
a siloxane compound comprising a cycloaliphatic epoxy group and a siloxane group; and
a curing agent,
the siloxane compound being represented by the following formula:
epoxycycloalkyl-CH 2 O—CO-hydroxycycloalkyl-OSiR 1 R 2 O—(SiR 3 R 4 O) n —SiR 5 R 6 O-hydroxycycloalkyl-CO—CH 2 O-epoxycycloalkyl,
wherein each of R 1 to R 6 is independently selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is a positive integer, and
wherein the hydroxycycloalkyl group comprises a cycloalkyl group having 5 to 20 carbon atoms.

2. The epoxy resin composition as claimed in claim 1 , wherein the triazine derivative epoxy compound comprises an isocyanurate ring.

3. The epoxy resin composition as claimed in claim 2 , wherein the triazine derivative epoxy compound comprises triglycidylisocyanurate (TGIC).

4. The epoxy resin composition as claimed in claim 1 , wherein the cycloaliphatic epoxy group is the epoxycycloalkyl group comprising a cycloalkyl group having 5 to 20 carbon atoms.

5. The epoxy resin composition as claimed in claim 1 , wherein the siloxane compound is represented by the following formula:

wherein each of R1 to R6 is independently selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is a positive integer.

6. The epoxy resin composition as claimed in claim 5 , wherein each of R1 to R6 is independently a methyl group; and 1≦n≦16.

7. The epoxy resin composition as claimed in claim 6 , wherein each of R1 to R6 is independently a methyl group; and 2≦n≦8.

8. The epoxy resin composition as claimed in claim 7 , wherein each of R1 to R6 is independently a methyl group; and 3≦n≦5.

9. The epoxy resin composition as claimed in claim 1 , wherein the curing agent comprises an acid anhydride-based curing agent.

10. A light-emitting apparatus comprising:
a molded body comprising a cured material; and
a light-emitting element mounted on the molded body,
wherein the cured material comprises an epoxy resin composition,
the epoxy resin composition comprising: a triazine derivative epoxy compound; a siloxane compound containing a cycloaliphatic epoxy group and a siloxane group; and a curing agent,
the siloxane compound being represented by the following formula:
epoxycycloalkyl-CH 2 O—CO-hydroxycycloalkyl-OSiR 1 R 2 O—(SiR 3 R 4 O) n —SiR 5 R 6 O-hydroxycycloalkyl-CO—CH 2 O-epoxycycloalkyl,
wherein each of R 1 to R 6 is independently selected from the group consisting of H, Cl, Br, F, C1-C3 alkyl, C2-C3 alkene, and C2-C3 alkyne; and n is a positive integer, and
wherein the hydroxycycloalkyl group comprises a cycloalkyl group having 5 to 20 carbon atoms.

11. The light-emitting apparatus as claimed in claim 10 , wherein the molded body comprises a dented portion comprising a bottom side and a lateral side,
wherein the light-emitting element is mounted on the bottom side of the dented portion and sealed with a sealing member.

12. The light-emitting apparatus as claimed in claim 11 , wherein the sealing member comprises at least one of the triazine derivative epoxy compound and the siloxane compound.

Assignees

• Lg Innotek Co Ltd

Inventors

• Jeong Jaehun
• Moon Sung Bae
• Yoon Sang In
• Lee Mi Jin
• Lee Yuwon

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/40

  characterised by their materials · CPC title

• C08G59/3281

  containing silicon · CPC title

• C08G59/306

  containing silicon · CPC title

• C08G77/14

  containing silicon bound to oxygen-containing groups · CPC title