Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device

Patent metadata

Field	Value
Publication number	US-9809489-B2
Application number	US-201514849960-A
Country	US
Kind code	B2
Filing date	Sep 10, 2015
Priority date	Sep 12, 2014
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A composition for forming a conductive film includes at least one of a metal salt (A1) and a metal particle (A2) as component (A) that serves as a metal source of the conductive film, and a metalloxane compound (B). The metal salt (A1) and the metal particle (A2) contain one or more metals selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au. The metalloxane compound (B) has at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain. Preferably, the metal salt (A1) is a carboxylate containing a metal selected from the group consisting of Cu, Ag, and Ni. Preferably, the metal particle (A2) has an average particle diameter of 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.

First claim

What is claimed is:

1. A composition for forming a conductive film, the composition comprising:
a metal salt (A1) and, optionally, a metal particle (A2) as a component (A) that serves as a metal source of the conductive film, wherein the metal particle (A2) comprise at least one metal selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;
wherein the metal salt (A1) is a carboxylate comprising a metal selected from the group consisting of Cu, Ag, and Ni; and
a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain.

2. The composition for forming a conductive film according to claim 1 , wherein the carboxylate is at least one selected from the group consisting of copper formate, silver formate, and nickel formate.

3. The composition for forming a conductive film according to claim 1 , wherein the composition comprises the metal particle (A2) that has an average particle diameter of from 5 nm to 100 nm and comprises a metal selected from the group consisting of Cu, Ag, and Ni.

4. The composition for forming a conductive film according to claim 1 , wherein the content of the component (B) is from 20% by mass to 80% by mass relative to 100% by mass in total of the masses of the component (A) and the component (B).

5. The composition for forming a conductive film according to claim 1 , further comprising (C) an amine compound.

6. A method for producing a plating film, the method comprising:
forming a conductive film from a composition comprising:
a metal salt (A1) and, optionally, a metal particle (A2) as a component (A) that serves as a metal source of the conductive film, wherein the metal particle (A2) comprises at least one metal selected from the group consisting of Ni, Pd, Pt, Cu, Ag, and Au;

wherein the metal salt (A1) is a carboxylate comprising a metal selected from the group consisting of Cu, Ag, and Ni; and
a metalloxane compound (B) having at least one metal atom selected from the group consisting of Ti, Zr, Sn, Si, and Al in its main chain; and

producing a plating film by plating the conductive film.

7. The method for producing a plating film according to claim 6 , wherein the carboxylate is at least one selected from the group consisting of copper formate, silver formate, and nickel formate.

Assignees

• Jsr Corp

Inventors

• Shimoda Sugirou
• Ookita Kenzou
• Satou Keisuke
• Watanabe Kazuto

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• C03C2218/365

  Coating different sides of a glass substrate · CPC title

• H01B1/02

  mainly consisting of metals or alloys · CPC title

• H05K3/188

  by direct electroplating · CPC title