Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device
US-9809489-B2 · Nov 7, 2017 · US
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Patent family 55456244
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 55456244 |
| Family type | — |
| Earliest priority | Sep 12, 2014 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9809489B2 — Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device |
Representative publication
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US9809489B2 — Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device (published Nov 7, 2017)
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