Polishing system with front side pressure control

Patent metadata

Field	Value
Publication number	US-9808906-B2
Application number	US-201615173491-A
Country	US
Kind code	B2
Filing date	Jun 3, 2016
Priority date	Mar 15, 2013
Publication date	Nov 7, 2017
Grant date	Nov 7, 2017

Abstract

A polishing apparatus includes a platen having a first surface to support a polishing pad and a second surface, a carrier head to hold a substrate against the polishing pad, a plurality of through-holes defined in the platen, and a pad pressure control assembly adjacent on a side of the platen opposite the carrier head.

First claim

What is claimed is:

1. A polishing apparatus, comprising:
a platen having a first surface to support a polishing pad, a second surface on a side of the platen opposite the first surface, and a plurality of holes extending through the platen from the first surface to the second surface, the plurality of holes arranged in a regular first pattern;
a carrier head to hold a substrate against the polishing pad; and
a pad pressure control assembly adjacent a side of the platen opposite the carrier head, wherein the pressure control assembly comprises a body having a third surface substantially parallel to the second surface of the platen and a plurality of conduits formed therein, wherein each conduit is configured to have an output end of the conduit on the third surface to provide a plurality of output ends, wherein the pad pressure control assembly is configured to direct fluid from the conduits to apply pressure through at least some of the plurality of holes to an underside of the polishing pad, wherein the plurality of conduits of the pressure control assembly are grouped into a plurality of independently controllable annular zones arranged in a second pattern that is different from the first pattern, wherein fluid flow through the conduits in each annular zone of the plurality of independently controllably annular zones is commonly controlled, and wherein the second surface of the platen is separated from the third surface of the body of the pad pressure control assembly by a gap that spans across the plurality output ends of the plurality of conduits in the body.

2. The polishing apparatus of claim 1 , further comprising a bearing ring surrounding body of the plurality of pad pressure control assembly to seal an interface between the body and the platen.

3. The polishing apparatus of claim 2 , wherein the bearing ring comprises a contact bearing ring to contact a bottom surface of the platen.

4. The polishing apparatus of claim 1 , further comprising a linear rail which supports the body and along which the body can move in a first direction in a plane parallel to the first surface of the platen, the plane being the first distance away from the platen.

5. The polishing apparatus of claim 1 , wherein the annular zones are concentric around a center of the body.

6. The polishing apparatus of claim 5 , wherein the platen is rotatable about an axis, and the center of the body is offset from the axis.

7. The polishing apparatus of claim 1 , wherein a distance between the body and the second surface of the platen is adjustable.

8. The polishing apparatus of claim 1 , wherein the first pattern is a rectangular pattern.

9. The polishing apparatus of claim 1 , wherein the first pattern is a non-polar pattern.

Assignees

• Applied Materials Inc

Inventors

• Chang Shou-Sung
• Fujikawa Takashi
• Chen Hung Chih
• Butterfield Paul D

Classifications

• B24B37/005 Primary

  Control means for lapping machines or devices · CPC title

• B24B37/32

  Retaining rings · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B49/16

  taking regard of the load · CPC title

• B24B37/16

  characterised by the shape of the lapping plate surface, e.g. grooved · CPC title