Substrate separation apparatus for stacked body

Patent metadata

Field	Value
Publication number	US-9805953-B2
Application number	US-201514699576-A
Country	US
Kind code	B2
Filing date	Apr 29, 2015
Priority date	May 3, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

A wedge-shaped jig ( 6 ) is inserted into a gap between a first substrate ( 21 ) and a second substrate ( 22 ) at a corner ( 221 ) of the second substrate ( 22 ) and separation of the attached first substrate ( 21 ) and second substrate ( 22 ) starts to proceed; then, a second suction pad ( 53 ) of a second suction portion ( 51 ), which is the closest to the corner ( 221 ), moves upward. Then, first suction pads ( 43 ) of first suction portions ( 41 a ), ( 41 b ), and ( 41 c ) sequentially move upward such that one side of the second substrate ( 22 ) separates from the stacked body. Although the second substrate ( 22 ) warps as the separation of the second substrate ( 22 ) proceeds, each of the plurality of first suction pads ( 43 ) elastically deforms. Therefore, the first suction pads ( 43 ) can be prevented from being detached from the second substrate ( 22 ), and the substrate ( 22 ) can be securely separated from the stacked body.

First claim

The invention claimed is:

1. A substrate separation apparatus configured to separate a second substrate from a first substrate, comprising:
a fixing jig capable of fixing the first substrate;
a first suction unit over the fixing jig comprising:
first suction portions each comprising:
first suction pads capable of being attached to a top surface of the second substrate by suction; and

a second suction unit over the fixing jig comprising:
a second suction portion comprising:
a second suction pad capable of being attached to the top surface of the second substrate by suction,

wherein the substrate separation apparatus is configured so that a suction power of the second suction pad is higher than a total suction power of all of the first suction pads of each of the first suction portions.

2. The substrate separation apparatus according to claim 1 , further comprising:
a separation starting jig capable of being inserted into a gap between the first substrate and the second substrate to separate the second substrate from the first substrate,
wherein the second suction portion is provided closer to the separation starting jig than the first suction portions are.

3. The substrate separation apparatus according to claim 2 , further comprising:
a liquid supplying unit capable of supplying a liquid to the gap.

4. The substrate separation apparatus according to claim 1 , further configured so that the first suction portions are arranged on a center of the second substrate and along an outer periphery of the second substrate.

5. The substrate separation apparatus according to claim 1 , further configured so that the second suction portion is arranged at a corner of the second substrate.

6. The substrate separation apparatus according to claim 1 , further comprising:
a control mechanism capable of controlling movements of the second suction unit and the first suction unit.

7. The substrate separation apparatus according to claim 1 , wherein a suction area of the second suction pad of the second suction portion is larger than a total suction area of the first suction pads of the first suction portion.

8. The substrate separation apparatus according to claim 1 , wherein a shape of each of the first suction pads and a shape of the second suction pad are different from each other.

9. A substrate separation apparatus configured to separate a second substrate bonded to a first substrate, comprising:
a fixing jig capable of fixing the first substrate;
a first suction unit over the fixing jig comprising:
first suction portions each comprising:
first suction pads capable of being attached to a top surface of the second substrate over the first substrate by suction; and

a second suction unit over the fixing jig comprising:
a second suction portion comprising:
a second suction pad capable of being attached to the top surface of the second substrate by suction,

wherein the first suction portions are provided along an outer periphery of the second substrate,
wherein the second suction portion is provided near the outer periphery of the second substrate, and
wherein the substrate separation apparatus is configured so that a suction power of the second suction pad is higher than a total suction power of all of the first suction pads of each of the first suction portions.

10. The substrate separation apparatus according to claim 9 , further comprising:
a separation starting jig capable of being inserted into a gap between the first substrate and the second substrate to separate the second substrate from the first substrate,
wherein the second suction portion is provided closer to the separation starting jig than the first suction portions are.

11. The substrate separation apparatus according to claim 10 , further comprising:
a liquid supplying unit capable of supplying a liquid to the gap.

12. The substrate separation apparatus according to claim 9 , further configured so that the first suction portions are arranged on a center of the second substrate and along an outer periphery of the second substrate.

13. The substrate separation apparatus according to claim 9 , further configured so that the second suction portion is arranged at a corner of the second substrate.

14. The substrate separation apparatus according to claim 9 , further comprising:
a control mechanism capable of controlling movements of the second suction unit and the first suction unit.

15. The substrate separation apparatus according to claim 9 , wherein a suction area of the second suction pad of the second suction portion is larger than a total suction area of the first suction pads of the first suction portion.

16. The substrate separation apparatus according to claim 9 , wherein a shape of each of the first suction pads and a shape of the second suction pad are different from each other.

17. A method for separating a second substrate from a first substrate, comprising steps of:
attaching first suction pads of each of first suction portions of a first suction unit to a top surface of the second substrate by suction;
attaching a second suction pad of a second suction portion of a second suction unit to the top surface of the second substrate by suction;
moving the second suction pad to separate the second substrate from the first substrate; and
after the moving, moving the first suction pads to separate the second substrate from the first substrate,
wherein a suction power of the second suction pad is higher than a total suction power of all of the first suction pads of each of the first suction portions.

18. The method according to claim 17 , further comprising:
inserting a separation starting jig into a gap between the first substrate and the second substrate.

19. The method according to claim 18 , further comprising:
supplying a liquid to the gap by a liquid supplying unit.

20. The method according to claim 17 , wherein the first suction portions are arranged on a center of the second substrate and along an outer periphery of the second substrate.

21. The method according to claim 17 , wherein the second suction portion is arranged at a corner of the second substrate.

22. The method according to claim 17 , wherein movements of the second suction unit and the first suction unit are controlled by a control mechanism.

23. The method according to claim 17 , wherein a suction area of the second suction pad of the second suction portion is larger than a total suction area of the first suction pads of the first suction portion.

24. The method according to claim 17 , wherein a shape of each of the first suction pads and a shape of the second suction pad are different from each other.

Assignees

• Semiconductor Energy Lab

Inventors

• Ohno Masakatsu
• Idojiri Satoru
• Kikuchi Kanpei
• Hirakata Yoshiharu
• Yokoyama Kohei

Classifications

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P95/60

  Mechanical treatments, e.g. by ultrasounds · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title