Dual endpoint detection for advanced phase shift and binary photomasks

Patent metadata

Field	Value
Publication number	US-9805939-B2
Application number	US-201313774006-A
Country	US
Kind code	B2
Filing date	Feb 22, 2013
Priority date	Oct 12, 2012
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

The present invention provides a method and apparatus for etching a photomask substrate with enhanced process monitoring, for example, by providing for optical monitoring at certain regions of the photomask to obtain dual endpoints, e.g., etch rate or thickness loss of both a photoresist layer and an absorber layer. By monitoring transmissity of an optical beam transmitted through areas having photoresist layer and etched absorber layer at two different predetermined wavelength, dual process endpoints may be obtained by a signal optical detection.

First claim

The invention claimed is:

1. A method of determining dual etching endpoints on an etching process, comprising:
performing an etching process on an absorber layer disposed on a first surface of a substrate through a patterned photoresist layer in a plasma etch chamber;
directing radiation having a wavelength between about 200 nm and about 800 nm to an area of the absorber layer uncovered by the patterned photoresist layer during the etching process;
collecting a first optical signal transmitted through the area of the absorber layer uncovered by the patterned photoresist layer;
collecting a second optical signal transmitted through an area of the absorber layer covered by the patterned photoresist layer;
analyzing a waveform obtained from the optical signals at two different wavelengths; and
determining a first endpoint for etching the absorber layer and a second endpoint for etching the photoresist layer based on the transmitted optical signal at the two different wavelengths when an intensity of the transmitted first and second optical signals as detected is about 70 percent to 90 percent more than an initial first and the second optical signals.

2. The method of claim 1 , wherein the substrate is a photomask reticle.

3. The method of claim 1 , wherein the two different wavelengths comprises:
a first wavelength having a wavelength between about 200 nm and about 400 nm, and a second wavelength having a wavelength greater than 400 nm.

4. The method of claim 1 , wherein analyzing the waveform further comprises:
analyzing a first waveform in a transmission form plotted as a function of intensity verses time at a wavelength between about 200 nm and about 400 nm.

5. The method of claim 4 , wherein analyzing the waveform further comprises:
analyzing a second waveform as a function of time verses intensity at a wavelength greater than 400 nm.

6. The method of claim 1 , further comprising:
determining the first endpoint for etching the absorber layer in response to the optical signal becoming saturated.

7. The method of claim 1 , wherein the absorber layer is a Cr containing layer.

8. The method of claim 1 , further comprising:
determining the second endpoint for etching the photoresist layer in response to the optical signal becoming saturated.

9. The method of claim 3 , wherein the first wavelength is between about 230 nm and about 350 nm.

10. The method of claim 9 , wherein the second wavelength is between about 400 nm and about 800 nm.

11. The method of claim 1 , wherein the photoresist layer has a thickness between about 100 nm and about 1000 nm.

12. A method of determining dual etching endpoints on an etching process, comprising:
performing an etching process on a chromium containing layer disposed on a first surface of a substrate through a patterned photoresist layer in a plasma etch chamber;
directing a radiation source having a wavelength from about 200 nm and about 800 nm from the first surface of the substrate to areas both covered and uncovered by the patterned photoresist layer;
collecting a first optical signal transmitted through the area of the chromium layer uncovered by the patterned photoresist layer to obtain a first waveform from the transmitted first optical signal;
analyzing the first waveform obtained the transmitted first optical signal transmitted through the first surface of the substrate;
determining a first endpoint of the etching process when a change in slope of the first optical signal in the first waveform is about greater than 50 percent of an original detected slope;
collecting a second optical signal transmitted through an area of the absorber layer covered by the patterned photoresist layer to obtain a second waveform from the transmitted second optical signal;
analyzing the second waveform obtained from the second optical signals transmitted through the photoresist layer; and
determining a second endpoint of the etching process when a change in slope of the second waveform is about greater than 50 percent of an original detected slope.

13. The method of claim 12 , wherein the substrate is a photomask reticle.

14. The method of claim 12 , wherein the first wavelength is between about 200 nm and about 400 nm.

15. The method of claim 12 , wherein the second wavelength greater than 400 nm.

16. The method of claim 12 , wherein the first wavelength is between about 230 nm and about 350 nm.

17. The method of claim 12 , wherein the second wavelength is between about 400 nm and about 800 nm.

18. A method of determining dual etching endpoints on an etching process, comprising:
performing an etching process on a chromium containing layer disposed on a first surface of a substrate through a patterned photoresist layer in a plasma etch chamber;
directing a radiation source to areas of the chromium layer uncovered by the patterned photoresist layer and a surface of the photoresist layer;
collecting a first optical signal at a wavelength between about 200 nm and about 400 nm transmitted through the area uncovered by the patterned photoresist layer to obtain a first waveform from the transmitted first optical signal;
analyzing a first waveform obtained the transmitted first optical signal reflected from the first surface of the substrate;
determining a first endpoint of the etching process when a change in slope of the transmitted first optical signal is about greater than 50 percent of an original detected slope;
directing a second radiation source having a second wavelength about greater than 400 nm from the area of the surface of the photoresist layer;
collecting a second optical signal transmitted through the surface of the photoresist layer to obtain a second waveform from the transmitted second optical signal;
analyzing a second waveform obtained the transmitted second optical signal transmitted through the photoresist layer; and
determining a second endpoint of the photoresist layer when a change in slope of the transmitted second optical signal is about greater than 50 percent of an original detected slope.

Assignees

• Applied Materials Inc

Inventors

• Grimbergen Michael N

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/23

  characterised by multiple measurements, corrections, marking or sorting processes · CPC title

• H10P50/694

  characterised by their behaviour during the process, e.g. soluble masks or redeposited masks · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• G03F1/80

  Etching · CPC title