Heat sink for electronic component and associated manufacturing method
US-2024183524-A1 · Jun 6, 2024 · US
US9805839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9805839-B2 |
| Application number | US-201515119637-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 20, 2015 |
| Priority date | Sep 12, 2014 |
| Publication date | Oct 31, 2017 |
| Grant date | Oct 31, 2017 |
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An object of the present invention is to provide a resistive composition that can form a thick film resistor excluding a toxic lead component from a conductive component and glass and having characteristics equivalent to or superior to conventional resistors in terms of, in a wide resistance range, resistance values, TCR characteristics, current noise characteristics, withstand voltage characteristics and the like. The resistive composition of the present invention includes: ruthenium-based conductive particles including ruthenium dioxide; a glass frit that is essentially free of a lead component; and an organic vehicle, wherein the glass frit is a glass frit which is constituted such that in a case where a fired product of a mixture of the glass frit and the ruthenium dioxide has in a range of 1 kΩ/□ to 1 MΩ/□, the fired product exhibits a temperature coefficient of resistance in a plus range.
Opening claim text (preview).
The invention claimed is: 1. A resistive composition comprising: ruthenium-based conductive particles including ruthenium dioxide; a glass frit that is essentially free of a lead component; an organic vehicle and a functional filler, wherein the glass frit is a glass frit which is constituted such that in a case where a fired product of a mixture of the glass frit and the ruthenium dioxide has a value in a range of 1 kΩ/□ to 1 MΩ/□, the fired product exhibits a temperature coefficient of resistance in a plus range and wherein the functional filler is composite particles comprising glass particles which are essentially free of a lead component and conducting particles which have a smaller particle size than the glass particles and are essentially free of a lead component. 2. The resistive composition according to claim 1 , wherein the glass frit comprises, in terms of oxide, 20 to 45 mol % of BaO, 20 to 45 mol % of B 2 O 3 , and 25 to 55 mol % of SiO 2 . 3. The resistive composition according to claim 1 , wherein the ruthenium-based conductive particles have an average particle size D 50 of 0.01 to 0.2 μm. 4. The resistive composition according to claim 1 , wherein the glass particles have a glass transition point Tg′ satisfying a relationship of Tg<Tg′ with respect to a glass transition point Tg of the glass frit. 5. The resistive composition according to claim 4 , wherein the Tg is in a range of 450° C. to 700° C. and the Tg′ is 500° C. or more. 6. The resistive composition according to claim 1 , wherein the functional filler contains the conducting particles in an amount of 20 to 35 percent by mass. 7. The resistive composition according to claim 1 , wherein the conducting particles are ruthenium-based conducting particles containing ruthenium dioxide. 8. The resistive composition according to claim 1 , wherein the conducting particles have an average particle size D 50 of 0.01 to 0.2 μm. 9. The resistive composition according to claim 1 , wherein the functional filler has an average particle size D 50 of 0.5 to 5 μm. 10. A resistive composition set comprising a combination of two or more resistive compositions described in claim 1 , wherein the resistive compositions have different weight amounts of the ruthenium-based conductive particles and glass frit.
Thick film resistors · CPC title
containing lead · CPC title
Particles; Flakes · CPC title
containing calcium oxide, e.g. common sheet or container glass · CPC title
Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title
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