Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Method for processing a substrate and apparatus for performing the same
US9529267B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9529267-B2 |
| Application number | US-201313928446-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2013 |
| Priority date | Jun 30, 2009 |
| Publication date | Dec 27, 2016 |
| Grant date | Dec 27, 2016 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid. Therefore, efficiency of removing the photoresist layer may be improved.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for processing a substrate, the method comprising: arranging the substrate on which a photoresist layer is formed; providing a treatment liquid for removing the photoresist layer on the substrate; and providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid such that the mist and the treatment liquid react with each other so as to increase a temperature of the treatment liquid, an…
Assignees
Inventors
Classifications
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9529267B2 cover?
- A method for processing a substrate includes arranging the substrate on which a photoresist layer is formed and providing a treatment liquid for removing the photoresist layer on the substrate. The method also includes providing a mist including deionized water or hydrogen peroxide on the substrate to make contact with the treatment liquid so as to increase a temperature of the treatment liquid…
- Who is the assignee on this patent?
- Rho Eun-Su, Bae Jeong-Yong, Semes Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P50/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).