Vertical heat treatment apparatus

Patent metadata

Field	Value
Publication number	US-9803924-B2
Application number	US-201514633367-A
Country	US
Kind code	B2
Filing date	Feb 27, 2015
Priority date	Mar 4, 2014
Publication date	Oct 31, 2017
Grant date	Oct 31, 2017

Abstract

Disclosed is a vertical heat treatment apparatus. The apparatus includes: a heat treatment furnace provided with a furnace inlet at a lower end thereof; a cover unit disposed on the furnace inlet of the heat treatment furnace; a cover unit opening/closing mechanism configured to support the cover unit in a cantilever manner from a bottom side of the cover unit; and an auxiliary mechanism configured to press the cover unit from the bottom side of the cover unit when the cover unit is disposed on the furnace inlet. The auxiliary mechanism is provided with a toggle mechanism.

First claim

What is claimed is:

1. A vertical heat treatment apparatus for processing at least one semiconductor wafer, the heat treatment apparatus comprising:
a heat treatment furnace provided with a furnace inlet at a lower end thereof allowing the at least one semiconductor wafer to be transported into and out of the furnace inlet;
a cover unit configured to cover the furnace inlet of the heat treatment furnace;
a cover unit opening/closing mechanism configured to support the cover unit and to position the cover unit away from the furnace inlet when the at least one semiconductor wafer is being processed within the furnace or is being transported into or out of the furnace, and to position the cover unit to cover the furnace inlet at other times; and
an auxiliary mechanism comprising a toggle clamp with an extendible mechanism section, link plate, and auxiliary mechanism arm unit, the auxiliary mechanism configured to vertically rotate the auxiliary mechanism arm unit about a pivot point when the extendible mechanism section extends and rotates the link plate, such that the auxiliary mechanism arm unit will then clamp the cover unit against the furnace inlet.

2. The vertical heat treatment apparatus of claim 1 , wherein the cover unit includes:
a furnace inlet shielding unit configured to block the furnace inlet, and
a support member configured to support the furnace inlet shielding unit through a plurality of elastic bodies.

3. The vertical heat treatment apparatus of claim 2 , wherein, when the auxiliary mechanism arm unit clamps the cover unit, the auxiliary mechanism arm unit presses an area inside of a region surrounded by contact points of the support member and the plurality of elastic bodies.

Assignees

• Tokyo Electron Ltd

Inventors

• Kikuchi Hiroshi
• Wakamori Tsutomu

Classifications

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title

• F27D2003/0086

  Up or down · CPC title

• F27D2003/0065

  Lifts, e.g. containing the bucket elevators · CPC title

• F27D3/0084

  Charging; Manipulation of SC or SC wafers · CPC title

• F27B17/0025 Primary

  specially adapted for treating semiconductor wafers · CPC title